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Patent Searching and Data


Title:
RADIO COMMUNICATION DEVICE AND METALLIC ARTICLE
Document Type and Number:
WIPO Patent Application WO/2011/111509
Kind Code:
A1
Abstract:
In order to obtain a radio communication device having a high radiation gain not only on a surface mounted on a metal plate or a metal member but on the surface opposite the mounted surface as well, and to obtain a metallic article, a radio communication device is disclosed that comprises a radio IC element (50) for processing a high frequency signal, a dielectric substrate (20), and a metal plate (30). A radiation conductor (25) coupled to the radio IC element (50) is disposed on the surface of the dielectric substrate (20), and a ground conductor (26) connected to the radiation conductor (25) via interlayer connecting conductors (27) is disposed on the back surface. The dielectric substrate (20) is adhered upon the metal plate (30) via an insulating adhesive (22) and is caulked at conductive members (35). The front and back surfaces of the metal plate (30) are made to electrically conduct by means of the conductive members (35), and when a high frequency signal is supplied from the radio IC element (50) over the radiation conductor (25), the interlayer connecting conductors (27), and the ground conductor (26), the high frequency signal current on the front side of the metal plate (30) is guided to the back side of the metal plate (30) via the interface sections between the conductive members (35) and the metal plate (30), and is emitted as a high frequency signal.

Inventors:
KATO NOBORU (JP)
SHIROKI KOJI (JP)
Application Number:
PCT/JP2011/053654
Publication Date:
September 15, 2011
Filing Date:
February 21, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
KATO NOBORU (JP)
SHIROKI KOJI (JP)
International Classes:
H01Q7/00; G06K19/07; G06K19/077; H01Q1/38
Domestic Patent References:
WO2010026939A12010-03-11
WO2009008296A12009-01-15
Foreign References:
JP2002521757A2002-07-16
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
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Claims: