RADIO WAVE TRANSMISSIVE SUBSTRATE

Title:

RADIO WAVE TRANSMISSIVE SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2020/054762

Kind Code:

A1

Abstract:

The present invention provides a radio wave transmissive substrate that has excellent transmissivity with respect to radio waves with frequencies of several hundred MHz to tens of GHz that are used in 4G and 5G. The present invention relates to a radio wave transmissive substrate comprising: a dielectric substrate; a heat reflective film that includes a conductive film on at least one principal surface of the dielectric substrate; and an opening where no conductive film exists in a plan view. At least a portion of the at least one principal surface in a plan view is formed as a radio wave transmissive region. The radio wave transmissive region satisfies the following expression (a) per 1 cm2 unit area: L > 802.6 × S − 503.7 … (a) (the definition of L and S in the expression (a) is given in the description).

Inventors:

MORITA SHIMPEI (JP)
TAKAHASHI KOUICHIROU (JP)
KAGAYA OSAMU (JP)
KAJIHARA TAKATO (JP)
MATSUMOTO AKIYO (JP)

Application Number:

PCT/JP2019/035699

Publication Date:

March 19, 2020

Filing Date:

September 11, 2019

Export Citation:

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Assignee:

AGC INC (JP)

International Classes:

C03C17/36; G02B5/26; C03C27/12

Foreign References:

JP2015205795A	2015-11-19
JP2017181911A	2017-10-05
JP2017056588A	2017-03-23
JP2006327381A	2006-12-07
JP2013006713A	2013-01-10
JP2018112707A	2018-07-19
JP2018097064A	2018-06-21
JP2015003388A	2015-01-08
JP2018172749A	2018-11-08
JP2018202102A	2018-12-27

Other References: