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Title:
RANDOM COPOLYMER COMPOUND, TERMINAL-MODIFIED POLYMER COMPOUND, AND RESIN COMPOSITION INCLUDING SAID COMPOUNDS
Document Type and Number:
WIPO Patent Application WO/2019/203112
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a terminal-modified polymer compound and a random copolymer compound which has high heat resistance and adhesion while having excellent film forming ability, and which has a low dielectric constant and a low dielectric loss tangent, and the present invention relates to a random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxyl groups at both terminal ends thereof, (B) an aliphatic polymer having alcoholic hydroxyl groups at both terminal ends thereof, and (C) a binding agent, wherein the number of moles a of the polyphenylene ether resin (A), the number of moles b of the aliphatic polymer (B), and the number of mole c of the binding agent (C) satisfy the relationship (a + b) > c.

Inventors:
AKATSUKA Yasumasa (31-12 Shimo 3-chome, Kita-k, Tokyo 88, 〒1158588, JP)
SHIRAI Kazuteru (31-12 Shimo 3-chome, Kita-k, Tokyo 88, 〒1158588, JP)
TANAKA Ryutaro (31-12 Shimo 3-chome, Kita-k, Tokyo 88, 〒1158588, JP)
NAGASHIMA Noriyuki (31-12 Shimo 3-chome, Kita-k, Tokyo 88, 〒1158588, JP)
Application Number:
JP2019/015774
Publication Date:
October 24, 2019
Filing Date:
April 11, 2019
Export Citation:
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Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA (1-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 05, 〒1000005, JP)
International Classes:
C08G65/48; C08F299/02; C08G18/72; C09J7/35; C09J171/12; C09J175/04
Foreign References:
JP2016532768A2016-10-20
JP2016524023A2016-08-12
JP2016210944A2016-12-15
JP2012046619A2012-03-08
JP2004170609A2004-06-17
JPH05271424A1993-10-19
JPH0586290A1993-04-06
JPH02153914A1990-06-13
Attorney, Agent or Firm:
KAMIMURA Yoichiro (9F E/Front bldg, 3-11 Kandaogawamachi Chiyoda-k, Tokyo 52, 〒1010052, JP)
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