Title:
RANDOM COPOLYMER COMPOUND, TERMINAL-MODIFIED POLYMER COMPOUND, AND RESIN COMPOSITION INCLUDING SAID COMPOUNDS
Document Type and Number:
WIPO Patent Application WO/2020/095829
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a random copolymer compound and a terminal-modified polymer compound having high heat resistance and adhesiveness while having exceptional film formation capabilities, and having a low dielectric constant and dielectric loss tangent. Specifically, disclosed is a random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxyl groups at both ends, (B) an aliphatic polymer having alcoholic hydroxyl groups at both ends, and (C) an acid dichloride compound that is a binder, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a + b) > c.
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Inventors:
AKATSUKA YASUMASA (JP)
SHIRAI KAZUTERU (JP)
SHIRAI KAZUTERU (JP)
Application Number:
PCT/JP2019/042972
Publication Date:
May 14, 2020
Filing Date:
November 01, 2019
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G63/00; C08F299/02; C09J7/35; C09J11/06; C09J157/00
Domestic Patent References:
| WO2011077297A1 | 2011-06-30 |
Foreign References:
| JP2013159638A | 2013-08-19 | |||
| JP2011225767A | 2011-11-10 | |||
| JP2001106884A | 2001-04-17 | |||
| JP2001192540A | 2001-07-17 | |||
| JP2001051415A | 2001-02-23 |
Attorney, Agent or Firm:
KAMIMURA Yoichiro (JP)
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