RATIOMETRIC DEVICE AND ARTICLE OF MANUFACTURE COMPRISING INSTRUCTIONS FOR RATIOMETRIC MEASUREMENT

The present patent application is related to a ratiometric device and an article of manufacture comprising at least one non-transitory, tangible machine readable storage medium containing executable machine instructions for ratiometric measurement. An object of the present patent application is to provide a ratiometric device and an article of manufacture comprising at least one non-transitory, tangible machine readable storage medium containing executable machine instructions for ratiometric measurement for achieving a high accuracy. The object is solved by the subject-matter of the independent claims. Further embodiments are described in the dependent claims.

In one example of a steady-state thermal conductivity/resistivity measurement, the accuracy of the measured thermal conductivity usually depends on an accurately measured temperature and well-controlled power dissipation. By Joule heating, when a heated resistor dissipates power (P) within an ambient environment, the generated temperature difference (ΔΓ) between the heater and the ambient environment is directly proportional to a thermal resistance (Θ) between them, as described by equation (1): ΑΤ = Ρ ^χ θ (1)

This technique can characterize various types of gases and/or parameters that are related to the gas properties. For example, when a suspended hot wire is surrounded by an ambient gas mixture, the gas mixture forms a certain thermal resistance between the hot wire and its ambient, hence resulting in a certain temperature difference between the hot wire and the ambient. Any change in gas composition will change the thermal resistance between the heater and its ambient, which finally results in a slightly different steady-state temperature of the heater.

In order to measure thermal resistance accurately, one prerequisite is that the dissipated power needs to be kept very stable or needs to be measured very accurately. For some gases (e.g. CO2) the stability requirement can be substantial. Temperature measurements, in some embodiments of thermal resistance measurement, are implemented by measuring a (temperature-dependent) electrical resistance of a heater. Three example techniques for measuring such electrical resistance immediately follow.

A first example technique for measuring electrical resistance is performed by measuring a sensor resistor and a reference resistor with same nominal resistance in a dual-slope RDC. This approach however does not take account of the practical mismatch of the nominal resistances within the sensor and reference resistors. In addition, two stable voltage references are also required in order to generate the two polarity currents in the dual-slope converter.

In a second example technique for measuring electrical resistance, a differential resistive sensor incorporating a pair of resistors with inverse characteristics is employed. This category of solutions includes both directly differential resistance-to-digital converter, and differential resistance-to-time converter. One advantage of this solution compared with the first example technique is an increase of the sensitivity and SNR. However, the matching of the two resistors would still be a concern.

In a third example technique for measuring electrical resistance, an additional cancellation circuit is used to memorize the baseline resistance in analogue memory. This technique does not have the resistor matching problem of the first two, but requires an analogue memory to provide the baseline resistance value acquired from an additional calibration phase. In addition, the matching of the transistors in the baseline cancellation circuit also influences the accuracy of final results. Instead of the three techniques mentioned above, a ratiometric resistance-to -digital converter (RDC) measures a thermal resistance of gas-sensitive device relative to that of a reference device, which is insensitive or less sensitive to the target gas. Using such a ratiometric RDC, an absolute baseline thermal resistance accuracy requirement can be shifted to a matching requirement of the sensitive and reference devices, and the power stability requirements would be relaxed.

In one example embodiment the ratiometric measurement is performed using resistors made by a same material and used as both sensor and reference devices. In addition, the ratiometric nature of the RDC is capable of narrowing the full scale of the RDC, thereby reducing the required dynamic range of resistance measurements. The technique is therefore well suited to interfacing the resistive sensors devoted to thermal conductivity measurement, in which small changes in resistance need to be digitized in the presence of a relatively large baseline resistance. According to another example embodiment, a ratiometric device, comprising: a current source having a first current, a second current different from the first current, and a current-select program; a sensor device responsive to a gas and having a sensor-cold temperature T(cold.sens) in response to the first current and a sensor-hot temperature T(hot,sens) in response to the second current; a reference device having a reference-cold temperature T(cold,ref) in response to the first current and a reference-hot temperature T(hot,ref) in response to the second current; and wherein the ratiometric device includes a temperature difference ratio output based on

T(cold,sens), T(hot,sens), T(cold.ref) and T(hot,ref).

According to yet another example embodiment, an article of manufacture comprises at least one non-transitory, tangible machine readable storage medium containing executable machine instructions for ratiometric measurement which comprise: generating a first current and a second current different from the first current; switching between the first and second currents at a current-select program; measuring, from a sensor device responsive to a gas, a sensor-cold temperature T(cold,sens) in response to the first current and a sensor-hot temperature T(hot,sens) in response to the second current; measuring, from a reference device a reference-cold temperature T(cold,ref) in response to the first current and a reference-hot temperature T(hot,ref) in response to the second current; wherein the reference device is less responsive to the gas than the sensor device; and calculating a temperature difference ratio; and generating a thermal conductivity device output signal based on the temperature difference ratio.

The above discussion/summary is not intended to represent every example embodiment or every implementation within the scope of the current or future Claim sets. The Figures and Detailed Description that follow also exemplify various example embodiments. Various example embodiments may be more completely understood in consideration of the following Detailed Description in connection with the accompanying Drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS The following description of figures may further illustrate and explain exemplary embodiments. Insofar as components, circuits, layers and method steps correspond to one another in terms of their function in different figures, the description thereof is not repeated for each of the following figures. Figures 1 A and IB are an example of a first ratiometric device. Figure 2 is an example of a second ratiometric device.

Figure 3 is an example programmable current source within the second ratiometric device.

Figure 4 is an example a first switched-capacitor circuit within the second ratiometric device. Figure 5 is an example a second switched-capacitor circuit within the second ratiometric device. Figure 6 is an example of a vertical cross-section of temperature compensation device within either the first or second ratiometric devices.

Figure 7 is an example set of ratiometric instructions.

Figure 8 is an example of a third ratiometric device.

While the disclosure is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that other embodiments, beyond the particular embodiments described, are possible as well. All modifications, equivalents, and alternative embodiments falling within the spirit and scope of the appended claims are covered as well.

DETAILED DESCRIPTION

An example thermal conductivity/resistivity measurement device is now discussed. In one example, the device employs a ratiometric measurement technique which lessens the challenge of implementing an accurate power reference. In another example, the device employs baseline resistance cancellation techniques which reduce the dynamic range of the electrical resistance measurement needed for thermal conductivity/resistivity measurements without the concerns mentioned above. In yet another example, the device employs a temperature compensation structure which reduces or omits the temperature dependency of the thermal conductivity/ resistivity measurement device. Each of these three techniques are now discussed in turn. Ratiometric Measurement Technique

Based on the principle of thermal conductivity measurement, in order to accurately measure presence and concentration of a gas, for example carbon-dioxide C0 ₂ , the dissipated power needs to be very stable. Sensitivity analysis shows that the stability requirement on the power reference is normally quite high (e.g. for lOOppm accuracy of CO2 concentration, the variation of the power reference in one example embodiment needs to be within ±50ppm).

Therefore, instead of measuring absolute thermal resistance of a sensor device (also known as gas sensor, transducer, hot wire sensor, or sensing resistor, or CC -sensitive device), measuring a thermal resistance of the sensor device relative to that of a reference device which is less sensitive to (or in another embodiment, shielded from) a gas to be sensed (e.g. CO2) relaxes the power reference stability requirement. Using this technique, the absolute power reference accuracy requirement can now be shifted to a matching requirement of the sensor device and reference device. In various embodiments, the reference device can be at least one of: a device which has similar thermal properties as the sensor device; a thermal conductivity reference device; or a device which is the similar to the sensor device but having a different thermal sensitivity. Figures 1A and IB are an example of a first ratiometric device 100 (e.g. front-end sensor). The first ratiometric device 100 includes two sensor devices 102, 104 which are exposed to a gas to be sensed, and two reference devices 103, 105 which are not exposed to the gas to be sensed.

In one example, the two reference devices 103, 105 use a same circuit wiring configuration and/or physical dimensions as the two sensor devices 102, 104. Another example embodiment of sensor and reference devices are also shown in Figure 2, discussed below. As suggested by the "R" labels, in one example embodiment the sensor and reference devices 103, 105 are resistors.

The reference devices 103, 105 in one example are included in a same package as the sensor devices 102, 104. In another example, the reference devices 103, 105 are included in a different package than the sensor devices 102, 104. This different package can be either on a separately sealed die in a same package as the sensor devices 102, 104, or in a separate package which is also hermetically sealed so that the reference sensor is not exposed to a gas to be sensed. The reference devices can also differ from the sensor devices by their geometry. The two sensor devices 102, 104, as well as the two reference devices 103, 105, are biased at two different current levels first current (I) 106 and second current (Lxl) 108 (also known as "LT" where "x" or "·" are both multiplication symbols and L is a number) so that four different temperatures are generated: Thot,ens, T _co id, sens, Thot,ref and T _co id,ref. Herein defined, "hot" refers to a device carrying a greater current (Lxl) and "cold" refers to a device carrying a lesser current (I). The actual temperatures of the devices may vary during operation and between different example embodiments. While the example embodiment in Figure 1 shows two constant current sources 106 and 108 which are used for determining the temperature of a pair of devices (e.g. the sensor devices 102, 104 or the reference devices 103, 105) under varying current loads (e.g. hot and cold current levels), in an alternate embodiment only one sensor device and one reference device can be operated in a time-multiplexed manner to collect a same set of temperature measurement data. In such an embodiment, a programmable (or switchable) current source (not shown in Figure 1) supplies the two different current levels 106, 108 according to a current-select program. The current-select program switches/swaps the current levels 106, 108 at either a periodic or non- periodic rate which can be fixed or variable. Two lower temperatures T _co id, sens and T _co id, ref serve as 'local' ambient temperatures for the sensor devices 102, 104 and reference devices 103, 105 respectively, and the parameter to be measured is:

AT sens T hot, sens - T cold , sens

AT (2)

ref hot, ref cold, ref

By measuring a ratio of temperature difference (i.e. ratiometric measurement) according to equation 2, ambient temperature variations appear as a common mode impact for the 'hot' and 'cold' devices. As shown in equation 3, the thermal resistance ratio can be expressed by the ratio of the temperature difference multiplied by the ratio of the power difference:

AT ( ΔΡ ref, hot, ref R ^~ cold ,ref

'ref ^{A T} ref ) , AP sens J . i · R hot ,sens— R cold ,sens J

(3) in which Ro is the nominal resistance at a reference temperature (e.g. 20°C) and a is the temperature dependence of the resistor.

If the nominal resistances and temperature dependence of sensor devices 102, 104 and reference devices 103, 105 are stable, the second term of the equation is a constant value and only the first and last terms need to be measured. If the bias first current / 106 and second current L-I 108 are substituted in, equation (3) is changed to:

Θ V hrot,, - L - V cold ,sens ^f L - V hot, ref - V cold , ref

CONSTANT (4)

Θ ref V hot , ref L ^' V cold , ref J hot,, - V c _r old ,sens J

Therefore, a gas dependent thermal resistance ratio can be obtained with the assistance of a readout circuit (not shown in Figure 1) to resolve the two voltage ratios.

Baseline Resistance Cancellation Technique:

With the addition of device swap switches 110, 1 11 , 112, 1 13 operated at f(swap) frequencies 114, 115 as shown in Figure 1 , the two sensor devices 102, 104 biased at two different current levels (/ 106 and L-I 108) can be swapped dynamically during device 100 operation. In one example embodiment, the device swap switches 110, 1 11 , 112, 1 13 use chopper circuits to perform the switching operation; however other switching devices can be used. The two-level currents (/ 106 and L-I 108) provide hot-and-cold measurements for both of the two sensor devices 102, 104 and two reference devices 103, 105 so as to acquire heated resistance and baseline resistance at the f(swap) frequencies 1 14, 1 15. The practical mismatch of the baseline resistances is cancelled out by the dynamic swapping during device 100 operation.

As illustrated in Figure 1 , when the device swap switches 1 10, 1 1 1 , 1 12, 1 13 are in straight connection (which was the case during the ratiometric measurement technique discussed above), Rsensori 102 is biased at a higher level current Lxl 108, while R _S ensor2 104 is biased at a lower level current I 106. Therefore Vi _n 1 16 (and correspondingly Vi _n 1 17 for the reference devices 103, 105) is directly proportional to the difference of the heated resistance of Rsensori 102

(Rsensori, hot) and the cold resistance (R _se nsor2,coid). The cold (i.e. low current 1 106) voltage (V2) is multiplied by voltage multiplier (xL) 1 1 8, 1 19 and the baseline resistance of R _se nsor2 104

(Rsensor2,coid) as shown in equation 5:

Similarly, when the device swap switches 1 10, 1 1 1 , 1 12, 1 13 are in cross connection, Rsensori 102 is biased at a lower level (i.e. cold) current I 106, while R _se nsor2 104 is biased at a higher level (i.e. hot) current Lxl 106. Therefore Vi _n 1 16 (and correspondingly Vi _n 1 17 for the reference devices 103, 105) represents the difference of the heated resistance of R _se nsor2 104 (R _se nsor2,hot) and the baseline resistance of Rsensori 102 (Rsensori ,coid) as shown in equation 6:

During device 100 operation, the device swap switches 1 10, 1 1 1 , 1 12, 1 13 are switched between straight and cross connections at the f(swap) frequencies 1 14, 1 15. Thus an effective resistance difference AR _e /f is equal to the average of Rsensori, hot and R _se nsor2,hot subtracted by the average of Rsensori, cold and R _S ensor2,coid as shown in equation 7:

Using the device swap switches 110, 1 11, 1 12, 113 and f(swap) frequencies 114, 1 15 as described above, any mismatch of the baseline resistances of the two sensor resistors does not impact the ratiometric measurement, since the measured resistance change is a difference of the averaged hot resistances and the averaged cold resistances of the two sensor resistors. In one example embodiment, any initial mismatch is minimized by trimming (see Figure 3) so as not to overload subsequent analog to digital voltage conversions (ADC) (e.g. of V(in) 1 16, 117).

In one example embodiment, the voltage multiplier (xL) 118, 1 19 and subtraction block 120, 121 can be implemented using a switched-capacitor circuit such as shown in Figure 4 and Figure 5.

Figure 2 is an example of a second ratiometric device 200 (e.g. front-end sensor) using a ΣΔ modulator ADC 201. The second ratiometric device 200 measures the ratio of thermal conductance in thermal conductivity based gas sensor applications. As discuss with respect to equation 1, one example of measuring thermal conductance uses both temperature and power information. To achieve this, the second ratiometric device 200 can be configured into either a temperature measurement mode, a power measurement mode or variable temperature and power measurement modes. A ratio of thermal conductivities can then be obtained by combining the results obtained in these two modes.

In Figure 2, two sensor resistors 202, 204 biased at two different current levels I(outl) and I(out2) are dynamically swapped using device swap switches 206, 208 to cancel or reduce out any mismatch between them. In addition, two reference resistors 210, 212 are also employed and operated in a similar manner as discussed earlier with respect ratiometric measurement in Figure 1. The two reference resistors 210, 212, are biased at current levels I(out3) and I(out4) are dynamically swapped using device swap switches 214, 216 to cancel out any mismatch between them. The currents I(outl), I(out2), I(out3) and I(out4) are generated by a programmable current source 218, such as shown in Figure 3 and now discussed.

Figure 3 is an example 300 programmable current source 218 with a current trimming function 302 within the second ratiometric device 200. Only two current outputs I(outl), I(out2) are shown in Figure 3, instead of all four, however I(out3) and I(out4) are generated in a similar way.

The output currents of the programmable current source 218 are digitally controlled such that when one sensor resistor 202 or 204 is being biased at a lower current level, the other sensor resistor 204 or 202 is being biased at a higher current level (vice versa). The same digitally control technique is also controls the reference resistors' 210, 212 currents I(out3) and I(out4).

In the example shown in Figure 3, each pair of the output currents are switched between a unit current (lower/cold level) and five times (or some other multiple of) the unit current (higher/hot level), and dynamic element matching (DEM) logic 304, 306 is adopted so as to generate an accurate current ratio (e.g. L=5).

Although the mismatch of the sensor (reference) resistors will not influence the accuracy of the measured AR _e ff (as discussed with respect to equation 4), the current trimming function 302 can be included to reduce the mismatch to a level that will not overload a ΣΔ modulator. A current ratio between I _ou ti and I _ou t2 (and also between 3 and I _ou t3) does not need to be maintained, as the effective sensor resistor is an average of the two sensor resistors and the DEM 304, 306 provides an accurate current ratio for the hot-and-cold measurements of the effective sensor resistor by sequentially generating an accurate current ratio of five for each current output.

Returning to Figure 2, voltages across the hot and cold resistors, V(inlp), V(inln), V(in2p), V(in2n), V(in3p), V(in3n), V(in4p), V(in4n) , are sampled with a switched-capacitor circuit 220 (SC Circuit), examples of which are shown in Figure 4 and Figure 5. Figure 4 is an example a first switched-capacitor circuit 400 within the second ratiometric device 200 whereby the second ratiometric device 200 is configured for the temperature measurement mode. In the circuit of Figure 4, capacitors having values C _s and 5C _S are used to sample the voltages across the hot and cold resistors.

Returning to Figure 2, the signal that will be digitized by the ΣΔ modulator ADC 201 is a ratio of the change in the effective reference resistor and that in the effective sensor resistor:

ejj ^sensor ' I LV\ sensor

In equation 8, μι is a bit stream density of this charge-balancing ΣΔ modulator ADC 201. If the sensor resistors 202, 204 and reference resistors 210, 212 are made by the same material, they should have the same temperature coefficient (TCR). Therefore a temperature difference ratio can be attained from equation 8.

If the example time -multiplexed embodiment (introduced above) is used, instead of having the pair of devices (i.e. either the pair of sensor resistors 202, 204 and/or the pair of reference resistors 210, 212) to obtain the hot and cold resistances simultaneously, only one sensor resistor 202 and reference resistor 210 are needed and which are operated in a time-multiplexed manner. In this scenario, the programmable current source 218 is digitally controlled to generate the unit current I(outl) and the multiplied current I(out2) serially (e.g. alternately). When the baseline resistance needs to be measured, the sensor resistor is biased at the unit current and the voltage across it will be sampled on the multiplied capacitor (5Cs). Then when the hot resistance needs to be measured, the sensor resistor is biased at the higher current (5*1) and the generated voltage is sampled on the unit capacitor (Cs). The same operations are applied to the one reference resistor. Thus the result indicated by equation 8 can be obtained similarly. In one example embodiment, any mismatch of Cs and 5Cs can be solved by Dynamic Elements Matching (DEM), wherein 5 unit capacitors (each of them has a typical value of Cs) are dynamically connected to the voltage inputs to be sampled in a time-interleaved manner. In this case, one sigma-delta period contains 2 sampling cycles. In the first sampling cycle, only the first unit capacitor is connected to the first input (e.g., Vhot) to sample the voltage and transfer charge to the integrator. In next sampling cycle, all 5 unit capacitors are connected to the second input (e.g., Vcold) to sample the voltage and transfer charge to the integrator. Similarly, in the following sigma-delta periods, only the second, third, fourth, or fifth unit capacitor is connected to the first input. The output of the RDC effectively reflects the average of the capacitor ratios among all cycles, and therefore an accurate 1 :5 ratio of the capacitors is attained.

In a second example embodiment of the capacitor DEM, in one RDC conversion cycle, the voltages cold and hot voltages are sampled with unit capacitors. The first voltage (eg. Vhot) is sampled by 5 capacitors, the second voltage is sampled by 1 unit capacitor Cs. Then in the next cycles, the unit capacitor are switched to the first voltage sequentially, the remaining capacitors sampling the second voltage one by one. In this way a very accurate 1 :5 ratio is obtained at the cost of a six times higher clock frequency.

In a third example embodiment, only one unit capacitor is used to sample the first and second voltage. For example, first the first voltage is sampled, in a next phase the second voltage is sampled 5 times, also leading to a very accurate 1 :5 ratio.

In other example embodiments, a combination of the above DEM techniques or alternative DEM techniques can be implemented to achieve accurate capacitor ratios.

Figure 5 is an example a second switched-capacitor circuit within the second ratiometric device whereby the second ratiometric device 200 is configurable between the temperature and the power measurement modes by the addition of switches 502, 504 at the inputs of the switched- capacitor circuit 220. The switches 502, 504 multiplex the input voltages so that the voltages across the hot and cold resistors are now sampled at 5C _S and C _s respectively. Thus, the signal to be digitized in power measurement mode is a ratio of power difference between hot and cold measurement of the effective reference resistor (average of the two reference resistors) and that of the effective sensor resistor (average of the two sensor resistors) as shown in equation 9:

(9)

A thermal conductance ratio of the sensor resistors 202, 204 and reference resistors 210, 212 then be derived by combining the measured temperature difference ratio and the power difference ratio in accordance with equation 10:

^ eff Reference eff Reference ^^eff , sensor

^ eff ,sensor ^ ^eff ,sensor ^^eff , reference

Temperature Compensation Structure

Figure 6 is an example of a vertical cross-section of temperature compensation structure 600 which can be incorporated into either the first or second ratiometric devices 100, 200. The temperature compensation structure 600 cancels out residual temperature dependency of a thermal conductivity sensor. In one example, such residue temperature dependency cancelation requires both the temperature of the sensor and reference devices and the ambient temperature.

To accomplish this, the temperature compensation structure 600 includes an auxiliary BJT temperature sensor 602 and a poly resistor 604 with low temperature coefficient. The sensor devices 102, 104 and reference devices 103, 105, from Figure 1, or sensor resistors 202, 204 and reference resistors 210, 212, from Figure 2, are measured relative to the on-chip poly resistor 604 whose temperature dependency is compensated by a the substrate-BJT temperature sensor 602 placed in close proximity to the poly resistor 604. The BJT temperature sensor 602 is also able to measure a temperature of the substrate which is considered as the local ambient of the thermal conductivity sensor.

Figure 7 is an example list of instructions for enabling a ratiometric device. The order in which the instructions of Figure 7 are discussed does not limit the order in which other example embodiments implement the instructions. Additionally, in some embodiments the instructions are implemented concurrently. A first example instructions set begins in 702, by generating a first current and a second current different from the first current. Next, in 704, switching between the first and second currents in accordance with a current-select program. Then in 706, measuring, from a sensor device coupled to a gas, a sensor-cold temperature T(cold.sens) in response to the first current and a sensor-hot temperature T(hot,sens) in response to the second current. In 708, measuring, from a reference device shielded from the gas or less sensitive to it, a reference-cold temperature T(cold,ref) in response to the first current and a reference-hot temperature T(hot,ref) in response to the second current. Then in 710, calculating a temperature difference ratio based on this equation:

A T sens T hot, sens - T cold, sens

AT ref T hot,ref - T cold ,ref

And then in 712, generating a thermal conductivity device output signal based

temperature difference ratio.

The instructions can be augmented with one or more of the following additional instructions, presented in no particular order. In 714, biasing the sensor device at the first current while the reference device is biased at the second current. In 716, reducing residual temperature dependency of the thermal conductivity device output signal by measuring the sensor device and reference device relative to a substrate poly resistor signal. In 718, compensating a temperature dependency of the poly resistor with a substrate B JT temperature sensor located proximate to the poly resistor.

Figure 8 is an example of a third ratiometric device 800. The system 800 shows an input/output data 802 interface with an electronic apparatus 804. The electronic apparatus 804 includes a processor 806, a storage device 808, and a machine -readable storage medium 810. The machine- readable storage medium 810 includes instructions 812 which control how the processor 806 receives input data 802 and transforms the input data into output data 802, using data within the storage device 808. Example instructions 812 stored in the machine -readable storage medium 810 are discussed elsewhere in this specification. The machine -readable storage medium in an alternate example embodiment is a computer-readable storage medium.

The processor (such as a central processing unit, CPU, microprocessor, application-specific integrated circuit (ASIC), etc.) controls the overall operation of the storage device (such as random access memory (RAM) for temporary data storage, read only memory (ROM) for permanent data storage, firmware, flash memory, external and internal hard-disk drives, and the like). The processor device communicates with the storage device and non-transient machine- readable storage medium using a bus and performs operations and tasks that implement one or more blocks stored in the machine -readable storage medium. The machine -readable storage medium in an alternate example embodiment is a computer-readable storage medium.

The blocks which comprise the instructions and/or flowcharts in the above Figures can be executed in any order, unless a specific order is explicitly stated. Also, those skilled in the art will recognize that while one example set of instructions have been discussed, the material in this specification can be combined in a variety of ways to yield other examples as well, and are to be understood within a context provided by this detailed description.

In some example embodiments the set of instructions described above are implemented as functional and software instructions embodied as a set of executable instructions which are effected on a computer or machine which is programmed with and controlled by said executable instructions. Such instructions are loaded for execution on a processor (such as one or more CPUs). The term processor includes microprocessors, microcontrollers, processor modules or subsystems (including one or more microprocessors or microcontrollers), or other control or computing devices. A processor can refer to a single component or to plural components.

In one example, one or more blocks or steps discussed herein are automated. The terms automated or automatically (and like variations thereof) mean controlled operation of an apparatus, system, and/or process using computers and/or mechanical/electrical devices without the necessity of human intervention, observation, effort and/or decision.

In this specification, example embodiments have been presented in terms of a selected set of details. However, a person of ordinary skill in the art would understand that many other example embodiments may be practiced which include a different selected set of these details. It is intended that the following claims cover all possible example embodiments.