Title:
RE-ATTACHABLE SOLID-PHASE ADHESIVE AND DEVICES
Document Type and Number:
WIPO Patent Application WO/2022/150142
Kind Code:
A3
Abstract:
A solid-phase adhesive that includes, based on 100 percent of the solids weight of the solid-phase adhesive, a low molecular weight resin, a triblock copolymer and a hydrophobic liquid. The low molecular weight resin is at a concentration of least 20 weight percent and is produced by the polymerization and hydrogenation of styrenic monomer feedstock having a ring and ball softening point of between about 10C and about 45C. The triblock copolymer is at a concentration of between about 2 weight percent and about 40 weight percent and includes a saturated elastomeric block intermediate opposite ends thereof and a thermoplastic block on each end. The hydrophobic liquid is at a concentration of up to about 50 weight percent.
Inventors:
SIEVERDING DAVID (US)
Application Number:
PCT/US2021/062581
Publication Date:
September 09, 2022
Filing Date:
December 09, 2021
Export Citation:
Assignee:
SIEVERDING DAVID (US)
International Classes:
C09J7/38; C08L53/02; C09J125/08
Foreign References:
| US4833193A | 1989-05-23 | |||
| US5994450A | 1999-11-30 | |||
| US20140141057A1 | 2014-05-22 | |||
| US4501842A | 1985-02-26 | |||
| US20220186090A1 | 2022-06-16 |
Attorney, Agent or Firm:
BONDI, Michael (US)
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