Title:
REACTIVE CURING AGENT
Document Type and Number:
WIPO Patent Application WO/2023/243516
Kind Code:
A1
Abstract:
Provided is a reactive curing agent that has improved solubility in methyl ethyl ketone and can improve the heat resistance of thermosetting resin compositions. The present invention provides a reactive curing agent comprising a copolymer containing an aromatic vinyl-based monomer unit, an unsaturated acid anhydride monomer unit, and a maleimide-based monomer unit, wherein the copolymer has a weight average molecular weight of 10,000 or more and less than 90,000, and contains 3.0 mass% or more and less than 49.0 mass% of the maleimide-based monomer unit when the total amount of the monomer units constituting the copolymer is taken as 100 mass%.
Inventors:
MATSUBARA TATSUHIRO (JP)
NISHIKAWA KAZUKI (JP)
OKAMOTO YOSHIKI (JP)
SAWASATO TADASHI (JP)
NISHIKAWA KAZUKI (JP)
OKAMOTO YOSHIKI (JP)
SAWASATO TADASHI (JP)
Application Number:
PCT/JP2023/021191
Publication Date:
December 21, 2023
Filing Date:
June 07, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F212/08; C08F8/32; C08G59/40
Domestic Patent References:
| WO2003087230A1 | 2003-10-23 | |||
| WO2010082617A1 | 2010-07-22 | |||
| WO2022234829A1 | 2022-11-10 |
Foreign References:
| JP2005008847A | 2005-01-13 | |||
| JP2005281445A | 2005-10-13 | |||
| JP2001019744A | 2001-01-23 | |||
| JP2008133353A | 2008-06-12 | |||
| JP2007056151A | 2007-03-08 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
Download PDF: