Title:
REACTIVE HOT MELT ADHESIVE COMPOSITION, BONDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/050225
Kind Code:
A1
Abstract:
The present invention discloses a reactive hot melt adhesive composition. This reactive hot melt adhesive composition contains a urethane prepolymer which contains a polymer chain that has a structural unit derived from a polyol including a polyester polyol and a structural unit derived from a polyisocyanate, and an isocyanate group that serves as an end group of the polymer chain. The polyester polyol includes a polyester polyol which has a structural unit derived from a divalent aliphatic carboxylic acid and a structural unit derived from a divalent aliphatic alcohol, wherein at least one of the divalent aliphatic carboxylic acid and the divalent aliphatic alcohol has a tertiary carbon atom or a quaternary carbon atom in each molecule.
Inventors:
KURAMOCHI CHIKA (JP)
KOMIYA SOUICHIROU (JP)
SAITO KOICHI (JP)
TABE YUSUKE (JP)
KOMIYA SOUICHIROU (JP)
SAITO KOICHI (JP)
TABE YUSUKE (JP)
Application Number:
PCT/JP2021/031754
Publication Date:
March 10, 2022
Filing Date:
August 30, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J175/06; C08G18/42
Domestic Patent References:
| WO2019082434A1 | 2019-05-02 |
Foreign References:
| JP2007091996A | 2007-04-12 | |||
| JP2018016703A | 2018-02-01 | |||
| JP2002188073A | 2002-07-05 | |||
| JP2020196801A | 2020-12-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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