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Patent Searching and Data


Title:
REACTIVE ION ETCHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/146267
Kind Code:
A1
Abstract:
Provided is a reactive ion etching device that is low-cost and of a simple structure, that allowsing the etching rate to be approximately uniform throughout, within the entirety of theentire surface of a processing target substrate to be processed. This reactive ion etching device EM is such that an electrostatic chuck 42 having a pair of electrodes 42b, 42c is provided on a stage 4, and the processing target substrate to be processed W is adsorbed attached electrostatically onto the electrostatic chuck by applying a direct current voltage to the pair of electrodes during thewhen etching of the processing target substrate to be processedW. This reactive ion etching device EM is constituted in such a manner that a high-frequency power source E2, which is connected via a first output line L1 to the stage and applying to apply a bias electric potential to the processing target substrate to be processed, and is connected via a second output line L2 to the pair of electrodes to apply a high-frequency electric potential that overlapping overlaps with the direct current voltage, . both the first and the second output lines having respectively aA first capacitor C1 and a second capacitor C2 are respectively provided for mediation, on the first output line and on the second output line and the electrostatic capacity ratio of the first capacitor relative to the second capacitor being is set to fall within the range of 0.25 to 25.

Inventors:
KAMIMURA Ryuichiro (INC. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
OSADA Yamato (INC. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
Application Number:
JP2018/044862
Publication Date:
August 01, 2019
Filing Date:
December 06, 2018
Export Citation:
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Assignee:
ULVAC, INC. (2500, Hagisono Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
International Classes:
H01L21/3065; H05H1/46
Foreign References:
JP2000252267A2000-09-14
JP2007109770A2007-04-26
Attorney, Agent or Firm:
SEIGA PATENT AND TRADEMARK CORPORATION (9th Fl, Saisho Bldg. 1-14, Nishi-Gotanda 8-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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