Title:
REACTIVE MATERIAL AND THIN FILM PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/008248
Kind Code:
A1
Abstract:
Provided is a reactive material that contains a compound represented by general formula (1) or (2). [Compound 1] (In formula (1), R1, R2, R3, and R4 each independently represent a hydrogen atom, a hydrocarbon group having 1-4 carbon atoms, or an electron-withdrawing group. At least one of R1, R2, R3, and R4 represents an electron-withdrawing group.) [Compound 2] (In formula (2), R5 and R6 each independently represent a hydrogen atom, a hydrocarbon group having 1-4 carbon atoms, or an electron-withdrawing group. At least one of R5 and R6 represents an electron-withdrawing group.)
Inventors:
ENZU MASAKI (JP)
Application Number:
PCT/JP2022/028006
Publication Date:
February 02, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C23C16/18; C07C21/14; C07C255/06; C07F15/00; C23C16/455
Domestic Patent References:
| WO2017043620A1 | 2017-03-16 | |||
| WO2020116364A1 | 2020-06-11 |
Foreign References:
| US20180291051A1 | 2018-10-11 | |||
| JP2003342734A | 2003-12-03 | |||
| JP2001163894A | 2001-06-19 | |||
| JP2003049267A | 2003-02-21 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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