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Title:
REACTIVE POWDER, BONDING MATERIAL USING REACTIVE POWDER, BONDED BODY BONDED WITH BONDING MATERIAL AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2014/188559
Kind Code:
A1
Abstract:
Provided is a reactive powder which is capable of a favorable and stable self-propagating high temperature synthesis (SHS) reaction. Also provided is a bonding material which, by using the reactive powder, enables a reliable bond while suppressing heat degradation of a member to be bonded without depending on a shape of a face to be bonded of the member to be bonded. This reactive powder is a reactive powder which enables a self-propagating high temperature synthesis, wherein the reactive powder comprises a first material and a second material that chemically react with each other, and inside each particle that constitutes the reactive powder first subgrains composed of the first material and second subgrains composed of the second material are chaotically mixed.

Inventors:
KAWANAKA HIROTSUGU (JP)
TAGUCHI MASAMI (JP)
HIROSE AKIO (JP)
OGURA TOMO (JP)
Application Number:
PCT/JP2013/064366
Publication Date:
November 27, 2014
Filing Date:
May 23, 2013
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
C09K5/16; B22F1/12; C09J201/00; H01L23/02
Domestic Patent References:
WO2011121686A12011-10-06
Foreign References:
JPH04288391A1992-10-13
JPH06287549A1994-10-11
JPS61127780A1986-06-16
JPH07136795A1995-05-30
JP2005288453A2005-10-20
JP2002275457A2002-09-25
JPH10265770A1998-10-06
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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