Title:
REACTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/088112
Kind Code:
A1
Abstract:
Disclosed is an adhesion composition for a hardly adhesive substrate, which has a sufficient adherability on a hardly adhesive substrate. A reactive resin composition comprising (A) an organic polymer having a reactive silicon group at a ratio of 0.8 group or more in average per molecule, (B) a crosslink-controlling agent, (C) a catalyst, and (D) a filler. The crosslink-controlling agent includes: (B-i) a silicone compound having one Si atom in the molecule and also having a hydroxyl group or groups and a hydrolysable group or groups attached to the Si atom, provided that the total number of the hydroxyl group(s) and the hydrolysable group(s) is 1 or 2; (B-ii) a silicone compound having 2 to 20 Si atoms in the molecule and also having a hydroxyl group or groups and a hydrolysable group or groups attached to any of the Si atoms, provided that the total number of the hydroxyl group(S) and the hydrolysable group(S) attached to all of the Si atoms in the molecule is 2 or 5 and the total number of the hydroxyl group and the hydrolysable group attached to each Si atom is 0 or 1; and (B-iii) a silicone compound represented by the general formula (1). R4-NH-R1-Si(R2)z(R3)3-z (1)
Inventors:
ITO HIROSHI (JP)
Application Number:
PCT/JP2006/302777
Publication Date:
August 24, 2006
Filing Date:
February 16, 2006
Export Citation:
Assignee:
KANEKA CORP (JP)
ITO HIROSHI (JP)
ITO HIROSHI (JP)
International Classes:
C08L101/10; C08K3/00; C08K5/54; C09J11/00; C09J171/02; C09J201/10
Domestic Patent References:
| WO2001012693A1 | 2001-02-22 |
Foreign References:
| JPH11116832A | 1999-04-27 | |||
| JPH08157734A | 1996-06-18 | |||
| JPS6239646A | 1987-02-20 | |||
| JPH0657121A | 1994-03-01 |
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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