REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC, CURED PRODUCT AND PHOTOSEMICONDUCTOR DEVICE

Title:

REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC, CURED PRODUCT AND PHOTOSEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/200110

Kind Code:

A1

Abstract:

Provided are: a reactive silicon composition which comprises at least (A) an organo polysiloxane having an alkenyl group, (B) an organo polysiloxane having an alkenyl group, (C) an organo polysiloxane having a silicon-bonded hydrogen atom, (D) a hydrosilylation reaction catalyst, (E) a white pigment, (F) spherical silica, nonspherical silica, or glass fiber, and (G) a carboxylic acid or metal salt thereof having ten or more carbon atoms and at least one carbon-carbon double bond per molecule; a reactive thermoplastic thereof, a cured product thereof and a photosemiconductor device having the cured product. The present invention provides: a reactive silicon composition which is capable of forming a reactive thermoplastic; a reactive thermoplastic which temporarily fluidizes when heated, then provides a cured product; a cured product which has small reduction in mechanical strength and less discoloration due to heat and light, a high optical reflectivity, and excellent mold releasability; and a photosemiconductor device which has a high luminous efficiency, less thermal degradation and photodegradation of a light reflection material, and excellent reliability.

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Inventors:

YAMAZAKI RYOSUKE (JP)
YOSHITAKE MAKOTO (JP)

Application Number:

PCT/JP2014/065831

Publication Date:

December 18, 2014

Filing Date:

June 10, 2014

Export Citation:

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Assignee:

DOW CORNING TORAY CO LTD (JP)

International Classes:

C08L83/07; C08K3/36; C08K5/09; C08K7/14; C08L83/05; H01L33/60

Domestic Patent References:

WO2013051600A1	2013-04-11
WO2011125753A1	2011-10-13

Foreign References:

JP2013076050A	2013-04-25
JPS5460356A	1979-05-15
JP2001214063A	2001-08-07

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