Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RECEIVING CONTAINER FOR PACKAGE BODY
Document Type and Number:
WIPO Patent Application WO/2014/192110
Kind Code:
A1
Abstract:
A receiving container (1) for a package body (10) which is formed by introducing into a packaging bag (12) a liquid substance to be packaged and packaging the liquid substance therein, the packaging bag (12) being formed by thermally bonding a sealant layer to the upper end or lower end of the flexible packaging bag body (11), the sealant layer being located on the outer surface of the base end of a non-return pouring nozzle (4) having a self-sealing function. The bottoms of the two side plates (2, 3) of the receiving container, which has a plate-like top section, are separated from each other by a bottom wall, and a protrusion section (5) is provided to one (2) of the two side plates (2, 3), the protrusion section (5) being configured so that the protrusion section (5) is superposed on one surface of the non-return pouring nozzle (4) to cover the entire non-return pouring nozzle (4) located on the inside, is capable of being folded and unfolded together with the pouring nozzle (4), and is capable of being cut away from the body of the receiving container, except an engagement tongue section (24). As a result of this configuration, the protrusion of a protruding small bag section which covers the film-like non-return nozzle is effectively prevented, and the entire container has a substantially uniform width and a good-looking shape.

Inventors:
FUTASE KATSUNORI (JP)
Application Number:
PCT/JP2013/064973
Publication Date:
December 04, 2014
Filing Date:
May 30, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YUSHIN CO LTD (JP)
International Classes:
B65D77/06
Domestic Patent References:
WO2013054411A12013-04-18
Foreign References:
JP2004196364A2004-07-15
JP2008105693A2008-05-08
JP2003237838A2003-08-27
Attorney, Agent or Firm:
GINZA MARONIE P. C. (JP)
Patent business corporation Ginza horse chestnut patent firm (JP)
Download PDF: