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Title:
RECEPTACLE MOLDING APPARATUS, RECEPTACLE AND RECEPTACLE MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/066430
Kind Code:
A1
Abstract:
The present invention provides a receptacle molding apparatus, a receptacle and a receptacle molding method. The receptacle molding apparatus, which is for molding a receptacle by means of heat molding, comprises: a first mold portion comprising a body molding part, which is for molding a body of a receptacle, a skirt molding part, which extends upward from the body molding part so as to mold a skirt of the receptacle, and a flange molding part which extends in the direction from the upper end of the skirt molding part toward the outside so as to mold the lower surface of a flange of the receptacle; and a second mold portion which is provided above the first mold portion, can move vertically and enable pressure-molding of the upper surface of the flange, and has a pressing surface for pressing a sheet which is to be molded into the flange from above at a position corresponding to the flange molding part. The pressing surface comprises an extension part which is a part extending further than the inner end part of the flange molding part in the direction toward the center of the body molding part.

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Inventors:
LEE BYUNG KOOK (KR)
PARK KWANG SOO (KR)
SONG HUI JAE (KR)
CHA GYU HWAN (KR)
Application Number:
PCT/KR2018/011310
Publication Date:
April 04, 2019
Filing Date:
September 21, 2018
Export Citation:
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Assignee:
CJ CHEILJEDANG CORP (KR)
International Classes:
B29C51/36; B29C51/10; B29D22/00
Foreign References:
KR20110034906A2011-04-06
JP2008531414A2008-08-14
KR20060088038A2006-08-03
KR20110119672A2011-11-02
JP2015006925A2015-01-15
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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