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Patent Searching and Data


Title:
RECONFIGURABLE HIGH-INTEGRATION-LEVEL RADIO FREQUENCY AMPLIFIER AND CHIP
Document Type and Number:
WIPO Patent Application WO/2022/188486
Kind Code:
A1
Abstract:
The present application provides a reconfigurable high-integration-level radio frequency amplifier and a chip. When a signal source sends a radio frequency signal to an input amplification circuit, a control circuit sends a first control signal to the input amplification circuit according to the frequency of the radio frequency signal, the input amplification circuit receives the first control signal and forms an input oscillation loop, the radio frequency signal forms an amplified first signal by means of the input oscillation loop, and the input amplification circuit sends the first signal to an output amplification circuit; and the control circuit transmits a second control signal to the output amplification circuit according to the frequency of the radio frequency signal, the output amplification circuit forms, under the action of the second control signal, an output oscillation loop matching the first signal, the first signal is amplified by the output oscillation loop to form a transmission signal, and the output amplification circuit sends the transmission signal to a transmitting antenna for transmission, such that the utilization rate of radio frequency front-end chip packaging is improved.

Inventors:
SU QIANG (CN)
LI YONGLE (CN)
YU LIMIN (CN)
XU BAIMING (CN)
Application Number:
PCT/CN2021/136085
Publication Date:
September 15, 2022
Filing Date:
December 07, 2021
Export Citation:
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Assignee:
SMARTER MICROELECTRONICS GUANG ZHOU CO LTD (CN)
International Classes:
H03F1/34
Foreign References:
CN112688644A2021-04-20
CN111082758A2020-04-28
US20150188500A12015-07-02
CN111293999A2020-06-16
CN106953604A2017-07-14
US20120075023A12012-03-29
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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