Title:
RECONFIGURABLE MODULAR MICROFLUIDIC SYSTEM AND METHOD OF FABRICATION
Document Type and Number:
WIPO Patent Application WO2004103562
Kind Code:
A3
Abstract:
A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or "chips" are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.
Inventors:
ZHOU PENG (US)
YOUNG LINCOLN (US)
YOUNG LINCOLN (US)
Application Number:
PCT/US2004/014811
Publication Date:
June 30, 2005
Filing Date:
May 12, 2004
Export Citation:
Assignee:
KIONIX INC (US)
ZHOU PENG (US)
YOUNG LINCOLN (US)
ZHOU PENG (US)
YOUNG LINCOLN (US)
International Classes:
B01L3/00; B01L9/00; B01L99/00; G01N30/60; (IPC1-7): G01N21/00; B01L3/00; B01L3/02; B01L11/00; G01N15/06; G01N31/22; G01N33/00; G01N33/48
Foreign References:
| US3548849A | 1970-12-22 | |||
| US6290791B1 | 2001-09-18 |
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