Title:
RECYCLING METHOD FOR POLISHING AGENT
Document Type and Number:
WIPO Patent Application WO/2013/069720
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a recycling method which achieves a high removal efficiency for a silicon component and an aluminum component and thus makes it possible to recover simply a polishing agent having polishing performance equivalent to that of a fresh polishing agent from a spent cerium oxide-based glass-polishing agent. A recycling method for recovering a polishing agent from a spent cerium oxide-based glass-polishing agent, including adjusting the pH of a spent cerium oxide-based glass-polishing agent slurry to 0.5 to 3.0.
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Inventors:
UEHARA TAISHI (JP)
FUJITA KOJI (JP)
HONMA YOSHIHIRO (JP)
FUJITA KOJI (JP)
HONMA YOSHIHIRO (JP)
Application Number:
PCT/JP2012/078942
Publication Date:
May 16, 2013
Filing Date:
November 08, 2012
Export Citation:
Assignee:
DOWA ECO SYSTEM CO LTD (JP)
International Classes:
B24B57/00; B24B37/00
Domestic Patent References:
| WO2010084635A1 | 2010-07-29 |
Foreign References:
| JPH10280060A | 1998-10-20 | |||
| JP2007276055A | 2007-10-25 | |||
| JP2008124213A | 2008-05-29 | |||
| JP2008279552A | 2008-11-20 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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Claims: