Title:
REFLECTING SUBSTRATE FOR LED LIGHT-EMITTING ELEMENT AND LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2013/108547
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a reflecting substrate for an LED light-emitting element and a LED package in which high light emission efficiency is maintained, and wire forming properties are excellent. This reflecting substrate for an LED light-emitting element is a reflecting substrate for an LED light-emitting element having a surface for mounting an LED light-emitting element, wherein, of the surface of the reflecting substrate for an LED light-emitting element, the surface in at least the section other than that where the LED light-emitting element is mounted has an arithmetic mean roughness Ra of 0.01-0.20 µm, and asperity average spacing Psm of 10 to 20 µm.
Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2012/083264
Publication Date:
July 25, 2013
Filing Date:
December 21, 2012
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L33/60
Domestic Patent References:
| WO2008023605A1 | 2008-02-28 | |||
| WO2010021089A1 | 2010-02-25 |
Foreign References:
| JP2010263165A | 2010-11-18 | |||
| JP2010109328A | 2010-05-13 | |||
| JP2009204837A | 2009-09-10 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
Download PDF:
Claims: