Title:
REFLOW-COMPATIBLE DICING TAPE
Document Type and Number:
WIPO Patent Application WO/2020/116448
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a reflow-compatible dicing tape having excellent contamination resistance by preventing the occurrence of outgassing from a radiation-curing adhesive layer. A reflow-compatible dicing tape according to the present invention is provided with a base material layer and a radiation-curing adhesive layer provided on said base material layer. After a silicon wafer is bonded to the radiation-curing adhesive layer, the layered body is irradiated with radiation and is then heat-treated for 10 minutes at 210°C. After said heat treatment, the bonded surface of the silicon wafer is measured by X-ray photoelectron spectroscopy when the silicon wafer is peeled from the radiation-curing adhesive layer. The carbon content at this time is 30 mol% or less.
Inventors:
ASANUMA TAKUMI (JP)
Application Number:
PCT/JP2019/047232
Publication Date:
June 11, 2020
Filing Date:
December 03, 2019
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301
Foreign References:
| JP2008027960A | 2008-02-07 | |||
| JP2012033636A | 2012-02-16 | |||
| JP2010129701A | 2010-06-10 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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