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Patent Searching and Data


Title:
REFLOW DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/120526
Kind Code:
A1
Abstract:
An inlet for N2 for cooling is provided below lower heating devices. N2 is supplied from below to the respective lower heating devices of zones (Z3-Z5) for performing preheating. N2 supplied from an N2 generation device (45) is divided by a branch section (46) into main supply and sub-supply for cooling. The sub-supply route is branched to three, and each of the branched routes has a valve (V3-V5) and a flow rate regulation volume (L3-L5). The conduction and interruption of the N2 for cooling relative to the zones (Z3-Z5) are controlled by switching the valves (V3-V5). In switching of lead-free solder to eutectic solder, N2 are introduced into the lower heating devices of the zones (Z3-Z5) to quickly lower the temperature of these zones.

Inventors:
IIJIMA MASAKI (JP)
YAMASHITA FUMIHIRO (JP)
Application Number:
PCT/JP2008/053889
Publication Date:
October 09, 2008
Filing Date:
February 27, 2008
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK (JP)
TAMURA FA SYSTEM CORP (JP)
IIJIMA MASAKI (JP)
YAMASHITA FUMIHIRO (JP)
International Classes:
B23K1/008; B23K1/00; B23K31/02; H05K3/34; B23K101/42
Foreign References:
JPH04134264U1992-12-14
JP2005095977A2005-04-14
JPH1071464A1998-03-17
JP2001198671A2001-07-24
JP2005014074A2005-01-20
JP2004197975A2004-07-15
Attorney, Agent or Firm:
SUGIURA, Masatomo (Metrocity Minami Ikebukuro29-12, Minami Ikebukuro 2-chom, Toshima-ku Tokyo, JP)
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