Title:
REFLOW DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/155939
Kind Code:
A1
Abstract:
A heating section (15) and a housing section (35) are provided with a transfer
path (41) therebetween. The heating section (15) heats a reflow surface (W1)
of an object to be heated (W). The housing section (35) has an open surface (36)
close to the transfer path (41) and a closed surface (36) facing the open surface
(36), and the distance from the transfer path (41) to the closed surface (37) of
the housing section (35) is longer than the distance from the transfer path (41)
to a radiation panel (19), so that the temperature inside the housing section
(35) can be made lower than the temperature inside the heating section (15).
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Inventors:
KAWAKAMI TAKEHIKO (JP)
TAMORI NOBUAKI (JP)
TAMORI NOBUAKI (JP)
Application Number:
PCT/JP2008/055989
Publication Date:
December 24, 2008
Filing Date:
March 21, 2008
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
TAMURA FA SYSTEM CORP (JP)
KAWAKAMI TAKEHIKO (JP)
TAMORI NOBUAKI (JP)
TAMURA FA SYSTEM CORP (JP)
KAWAKAMI TAKEHIKO (JP)
TAMORI NOBUAKI (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/008; F27B9/02; F27B9/10; F27B9/12; F27D7/02; F27D7/04; F27D9/00
Foreign References:
JPH04134264U | 1992-12-14 | |||
JP2004214553A | 2004-07-29 | |||
JP2003318530A | 2003-11-07 | |||
JP2000059020A | 2000-02-25 | |||
JP2001058259A | 2001-03-06 |
Attorney, Agent or Firm:
SUGIURA, Masatomo (Metrocity Minami Ikebukuro 29-12, Minami Ikebukuro 2-chome, Toshima-k, Tokyo 22, JP)
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