Title:
REFLOW SN PLATED MEMBER
Document Type and Number:
WIPO Patent Application WO/2011/065166
Kind Code:
A1
Abstract:
Disclosed is a reflow Sn plated member wherein the occurrence of whiskers is suppressed, and which has reduced insertion/removal force. A reflow Sn layer is formed on the surface of base material comprising Cu or a Cu-based alloy, and the orientation index of the (101) plane of the surface of said reflow Sn layer is at least 2.0 and no more than 5.0.
Inventors:
MAEDA NAOFUMI (JP)
Application Number:
PCT/JP2010/068901
Publication Date:
June 03, 2011
Filing Date:
October 26, 2010
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
MAEDA NAOFUMI (JP)
MAEDA NAOFUMI (JP)
International Classes:
C25D7/00; C25D5/50; H01R13/03
Domestic Patent References:
| WO2007142352A1 | 2007-12-13 |
Foreign References:
| JP2006265642A | 2006-10-05 | |||
| JP2002266095A | 2002-09-18 | |||
| JP2008274316A | 2008-11-13 | |||
| JP2003293187A | 2003-10-15 | |||
| JP2007063624A | 2007-03-15 | |||
| JP3986265B2 | 2007-10-03 |
Other References:
See also references of EP 2495354A4
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
Ken-ichiro Akao (JP)
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