REFLOW SOLDERING METHOD FOR AMELIORATING THERMAL EXPANSIVE DEFORMATION OF DEVICE

WIPO Patent Application WO/2020/119555

A1

A reflow soldering method for ameliorating thermal expansive deformation of a device, comprising the following steps: preparing a SMT steel mesh, printing a solder paste on a PCB board by means of the SMT steel mesh and putting the PCB board printed with the solder paste into a surface mounting machine for SMT surface mounting; putting the surface mounted PCB board into a reflow soldering furnace and feeding heated nitrogen into the reflow soldering furnace; carrying out a first temperature raise, the temperature raising speed being less than or equal to 2℃/s; maintaining the temperature, increasing the fan rotating speed at an upper tuyere and maintaining the fan rotating speed unchanged at an lower tuyere; carrying out a second temperature raise, the temperature raising speed being less than or equal to 2℃/s; carrying out reflow soldering; cooling and finishing the soldering; and carrying out follow-up testing; The reflow soldering method can lower the peak temperature of reflow soldering, and thus widens process window index (PWI), achieves a good soldering and melting effect, reduces the temperature difference between a component and the PCB board and avoids pseudo soldering and deformation caused by excessive temperature differences.

ZHANG LONG (CN)
YE GENGQING (CN)

PCT/CN2019/123054

June 18, 2020

December 04, 2019

Click for automatic bibliography generation  

DBG TECH CO LTD (CN)

B23K1/008; B23K3/06; B23K3/08

CN109604754A	2019-04-12
CN106270885A	2017-01-04
CN201279641Y	2009-07-29
CN105397221A	2016-03-16
CN103648700A	2014-03-19
US20050189402A1	2005-09-01
EP1427073A1	2004-06-09

HUIZHOU CHUANGLIAN PATENT AGENT FIRM(GENERAL PARTNERSHIP) (CN)

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