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Patent Searching and Data


Title:
REFRACTORY MOLD FOR SINTERING PRECURSOR MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/239101
Kind Code:
A1
Abstract:
The present invention relates to a refractory mold for sintering precursor material and, more specifically, to a refractory mold equipped with a space inwardly for accommodating the precursor material, wherein when used, the refractory mold makes it possible to suppress the generation of by-products during the sintering of the precursor material while simultaneously enhancing the durability of a main body.

Inventors:
SONG HEEYOUB (KR)
KONG BO HYUN (KR)
KIM SU JIN (KR)
KWAK HWAN WOOK (KR)
JO MIN SU (KR)
NAM YU JIN (KR)
CHOI MOON HO (KR)
YOON INHO (KR)
LEE SEUNG HO (KR)
BYOUN YOUNGWOO (KR)
KIM SOO BONG (KR)
JEONG JAEYOON (KR)
LEE SEOKMIN (KR)
Application Number:
PCT/KR2023/007386
Publication Date:
December 14, 2023
Filing Date:
May 30, 2023
Export Citation:
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Assignee:
ECOPRO BM CO LTD (KR)
International Classes:
C04B35/66; C04B35/01; C04B35/19; C04B41/87; F27D5/00
Foreign References:
JP2022070459A2022-05-13
CN114195533A2022-03-18
JP2011201762A2011-10-13
KR20130115688A2013-10-22
KR20120102396A2012-09-18
Attorney, Agent or Firm:
KIM, Hyung Min (KR)
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