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Title:
REFRIGERANT PIPING, METHOD FOR MANUFACTURING REFRIGERANT PIPING, CONNECTION STRUCTURE FOR REFRIGERANT PIPING, AND VALVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/135883
Kind Code:
A1
Abstract:
Provided are: refrigerant piping which can be easily connected using brazing even when the materials thereof are different from each other; a method for manufacturing the refrigerant piping; a connection structure for the refrigerant piping; and a valve device. A coupling member 100 composed of stainless steel has, on an inner peripheral surface 100a or an outer peripheral surface 100b on at least one longitudinal end section thereof, a copper or copper-alloy film 200 that is formed by metal bonding. Accordingly, even when the coupling member 100 itself is composed of stainless steel, the coupling member can be easily connected with a connection target using brazing through the end section in which the copper or copper-alloy film 200 is formed.

Inventors:
WATANABE HIDETAKA (JP)
MURATA MASAHIRO (JP)
MITOME RYO (JP)
OKADA SATOSHI (JP)
KEMMOTSU DAIICHIRO (JP)
Application Number:
PCT/JP2022/038874
Publication Date:
July 20, 2023
Filing Date:
October 19, 2022
Export Citation:
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Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
F16L9/02; F25B41/40
Domestic Patent References:
WO2020040158A12020-02-27
Foreign References:
JPS57154372A1982-09-24
JP2001289525A2001-10-19
JP2010110395A2010-05-20
JP2011033243A2011-02-17
JP2017099206A2017-06-01
JPS59190365A1984-10-29
JP2019095179A2019-06-20
JPS57171570A1982-10-22
JP2000205430A2000-07-25
JP2016070527A2016-05-09
Attorney, Agent or Firm:
TAKINO, Fumio et al. (JP)
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