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Patent Searching and Data


Title:
REFRIGERATION CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/004360
Kind Code:
A1
Abstract:
In this refrigeration cycle device (1), a heat source unit (2) and use units (4a, 4b) are connected via a gas refrigerant communication pipe (5) and a liquid refrigerant communication pipe (6) to form a refrigerant circuit (7). Carbon dioxide is sealed as a refrigerant in the refrigerant circuit (7). In the refrigeration cycle device (1), a pipe having an inner diameter of no greater than 6.2 mm is used as the gas refrigerant communication pipe and/or a pipe having an inner diameter of no greater than 3.6 mm is used as the liquid refrigerant communication pipe in order to reduce the amount of refrigerant sealed in the refrigerant circuit (7).

Inventors:
YAMADA TAKURO
KUMAKURA EIJI
IWATA IKUHIRO
Application Number:
PCT/JP2019/025058
Publication Date:
January 02, 2020
Filing Date:
June 25, 2019
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
F25B41/00; F24F1/32; F25B1/00
Domestic Patent References:
WO2015140827A12015-09-24
WO2011099063A12011-08-18
Foreign References:
JP2008032275A2008-02-14
JP2011027346A2011-02-10
JPH11257689A1999-09-21
JPS62156714U1987-10-05
JP2003139422A2003-05-14
JP2000105027A2000-04-11
Other References:
See also references of EP 3816544A4
Attorney, Agent or Firm:
SHINJYU GLOBAL IP (JP)
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