Title:
REFRIGERATION CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/203150
Kind Code:
A1
Abstract:
This refrigeration cycle device comprises a heat pump cycle (10), a high-temperature-side heat medium circuit (21), and a low-temperature-side heat medium circuit (30). The heat pump cycle has a compressor (11), a high-temperature-side heat medium-refrigerant heat exchanger (12), a heat absorption decompression unit (14b), and a low-temperature-side heat medium-refrigerant heat exchanger (16). The high-temperature-side heat medium circuit has a heat exchanger (23) for heating that exchanges heat between a high-temperature-side heat medium and a fluid of which the temperature is to be adjusted. The low-temperature-side heat medium circuit has: a plurality of heat absorption devices (31, 32, 36, 38) that causes heat to be absorbed in a low-temperature-side heat medium flowing out from the low-temperature-side heat medium-refrigerant heat exchanger; and heat absorption amount adjusting parts (33, 33a, 35a, 35b, 37) that change the heat absorption amounts of the low-temperature side heat mediums in the heat absorption devices, respectively. When the heat absorption amount adjusting parts change the heat absorption amounts of the low-temperature side heat mediums in the heat absorption devices, respectively, the refrigeration cycle device reduces the flow rate of a refrigerant flowing into the low-temperature-side heat medium-refrigerant heat exchanger.
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Inventors:
MIURA KOJI (JP)
KAWANO HIROAKI (JP)
YAMAGUCHI MOTOHIRO (JP)
TANIGUCHI KAZUYA (JP)
KATO YOSHIKI (JP)
MAKIHARA MASAMICHI (JP)
MAEDA TAKAHIRO (JP)
TANIOKA KUNIYOSHI (JP)
OKAMURA TORU (JP)
MAKIMOTO NAOYA (JP)
KAWANO HIROAKI (JP)
YAMAGUCHI MOTOHIRO (JP)
TANIGUCHI KAZUYA (JP)
KATO YOSHIKI (JP)
MAKIHARA MASAMICHI (JP)
MAEDA TAKAHIRO (JP)
TANIOKA KUNIYOSHI (JP)
OKAMURA TORU (JP)
MAKIMOTO NAOYA (JP)
Application Number:
PCT/JP2020/010924
Publication Date:
October 08, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B60H1/22; F25B5/02; F25B1/00
Domestic Patent References:
| WO2018142911A1 | 2018-08-09 | |||
| WO2017217099A1 | 2017-12-21 |
Foreign References:
| JP2015186989A | 2015-10-29 | |||
| JP47007951Y1 | ||||
| JPH09196479A | 1997-07-31 | |||
| JPH05133628A | 1993-05-28 |
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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