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Title:
REFRIGERATION CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/136002
Kind Code:
A1
Abstract:
This refrigeration cycle device has a refrigeration cycle (10) and a heat medium circuit (30), and cools a plurality of subjects to be cooled. The refrigerant cycle has a compressor (11), a condenser (13), a decompression unit (17a, 17b), and a plurality of evaporators (18, 19). The compressor compresses and discharges a refrigerant. The condenser condenses the high-pressure refrigerant that is discharged from the compressor. The decompression unit decompresses the refrigerant that has flowed out from the condenser. The plurality of evaporators vaporize the refrigerant that has been decompressed by the decompression unit and cools a heat medium circulating through the heat medium circuit. The heat medium circuit has a plurality of cooling units (31, 32, 33, 34) for cooling a plurality of subjects to be cooled through heat exchange with the heat medium. The heat medium circuit is configured to be capable of supplying the heat medium that has been cooled by at least one of the plurality of evaporators to at least one of the plurality of cooling units.

Inventors:
YAMADA ATSUSHI (JP)
SUZUKI SATOSHI (JP)
OTAKE HINANO (JP)
MAKIMOTO NAOYA (JP)
ITO SATOSHI (JP)
ENOMOTO NORIHIKO (JP)
Application Number:
PCT/JP2022/045448
Publication Date:
July 20, 2023
Filing Date:
December 09, 2022
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
F25B1/00; B60H1/22; F25B5/02; F25B43/00
Domestic Patent References:
WO2014016865A12014-01-30
Foreign References:
JP2022501252A2022-01-06
JP2007155230A2007-06-21
JP2006177632A2006-07-06
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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