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Patent Searching and Data


Title:
REINFORCEMENT COMPOSITION FOR ROTATIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO2003050177
Kind Code:
A3
Abstract:
A mixture of a carrier and binder component and polymer powders is provided as a molding composition for sealing rotational molds or for reinforcing selected areas of rotationally molded parts. The carrier and binder component can be very low density polyethylene, petroleum jelly, hydrocarbon wax, hydrocarbon tackifier, or mixtures thereof, and the polymer powders are thermoplastics having a low melt index. The molding composition is applied to selected areas of the rotational mold, such as to the mating flanges of the mold halves to seal the parting line of the mold, or to areas within the mold where it is desired to have reinforced regions of greater wall thickness, such as ribs or bosses.

Inventors:
STEVENSON MICHAEL J (US)
REEVES ROBERT A
Application Number:
PCT/US2002/038219
Publication Date:
February 26, 2004
Filing Date:
November 29, 2002
Export Citation:
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Assignee:
STEVENSON MICHAEL J (US)
International Classes:
B29C41/00; B29C41/06; C08L101/00; B29C33/74; B29C37/00; B29C41/20; B29C41/22; B29C73/02; (IPC1-7): C08K5/01
Foreign References:
US5532282A1996-07-02
US5648030A1997-07-15
US5674945A1997-10-07
US5726239A1998-03-10
US6180203B12001-01-30
Other References:
See also references of EP 1453903A4
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