REINFORCING FIBER BUNDLE AND MOLDING MATERIAL

Title:

REINFORCING FIBER BUNDLE AND MOLDING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2017/183672

Kind Code:

A1

Abstract:

Disclosed is a reinforcing fiber bundle which comprises a propylene resin (A), a propylene resin (B) that contains at least a carboxylic acid salt bonded to the polymer chain, and reinforcing fibers (C), and wherein: the propylene resin (A) contains more than 70% by mass but 100% by mass or less of a component (A-1) that has a weight average molecular weight of 150,000 or more; the amount of the propylene resin (B) relative to 100 parts by mass of the propylene resin (A) is 3-50 parts by mass; and the total content ratio of the propylene resin (A) and the propylene resin (B) is 0.3-5% by mass of the whole reinforcing fiber bundle. This reinforcing fiber bundle has excellent mechanical properties and excellent handling properties. Also disclosed is a molding material which contains this reinforcing fiber bundle and a matrix resin.

Inventors:

MIZUTA YASUSHI (JP)
ISAKI TAKEHARU (JP)
YOSHIDA MASAKO (JP)
ITOU YUICHI (JP)

Application Number:

PCT/JP2017/015803

Publication Date:

October 26, 2017

Filing Date:

April 19, 2017

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)

International Classes:

B29B15/08; C08J5/06; C08L23/16; C08L23/26; D06M15/227; B29K23/00

Domestic Patent References:

WO2010074118A1	2010-07-01
WO2010074108A1	2010-07-01
WO2006101269A1	2006-09-28

Foreign References:

JP2010149353A	2010-07-08
JP2005048343A	2005-02-24
JPH06107442A	1994-04-19
JP2015078331A	2015-04-23
JP2016006245A	2016-01-14

Other References: