Title:
REINFORCING FILM, DEVICE WITH REINFORCING FILM, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2022/050009
Kind Code:
A1
Abstract:
Provided is a reinforcing film which is easy to peel off directly after bonding with an adherend, which can be firmly adhered to the adherend by photocuring an adhesive after bonding with the adherend, and which is not susceptible to peeling due to a bending test. This reinforcing film (10) comprises an adhesive layer (2) fixedly layered on one principal surface of a film base material (1). The adhesive layer is composed of a photocurable composition containing a photocuring agent and an acrylic base polymer having a crosslinked structure. After photocuring, the adhesive layer preferably has a shear storage modulus at -20°C of 1.0 × 104 to 5.0 × 105 Pa, and a shear storage modulus at 25°C of 8.0 × 103 to 5.0 × 105 Pa.
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Inventors:
KATAOKA KENICHI (JP)
Application Number:
PCT/JP2021/029555
Publication Date:
March 10, 2022
Filing Date:
August 10, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B32B27/00; C09J4/02; C09J11/06; C09J133/04
Domestic Patent References:
| WO2019244499A1 | 2019-12-26 |
Foreign References:
| JP2020040389A | 2020-03-19 | |||
| US20190386247A1 | 2019-12-19 | |||
| JP2020513451A | 2020-05-14 | |||
| JP2020128532A | 2020-08-27 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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