BACKGROUND

[0001] Relative pressure sensors are used to sense relative pressure between different regions. Liquid containers, such as ink containers or ink cartridges may include relative pressure sensors to identify excessive pressure within the liquid container.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 is a top view of an example relative pressure sensor.

[0003] Figure 2 is an end view of the example relative pressure sensor of

Figure 1.

[0004] Figure 3 is a sectional view of the example relative pressure sensor of Figure 3 taken along line 3-3.

[0005] Figure 4 is a flow diagram of an example method for forming a relative pressure sensor.

[0006] Figure 5A is a top view of an example first stage of an example method for forming an example relative pressure sensor; Figure 5A illustrating an example substrate for the example relative pressure sensor.

[0007] Figure 5B is a sectional view of the example substrate of Figure 5A taken along line 5B-5B.

[0008] Figure 5C is an end view of the example substrate of Figure 5A. [0009] Figure 6A is a top view of an example second stage of an example method for forming the example relative pressure sensor; Figure 6A illustrating the example substrate of Figure 5A following application of an example cover over a channel of the substrate and about a cavity of the substrate.

[00010] Figure 6B is a sectional view of the example substrate of Figure 6A taken along line 6B-6B.

[00011] Figure 6C is an end view of the substrate of Figure 6A.

[00012] Figure 7A is a top view of an example pressure sensing die.

[00013] Figure 7B is a sectional view of the example pressure sensing die of Figure 7A.

[00014] Figure 8 is a top view of an example third stage of the example method for forming the example relative pressure sensor; Figure 8 illustrating the example substrate of Figure 6A after mounting of the pressure sensing die of Figure 7A.

[00015] Figure 9 is a top view of an example fourth stage of the example method for forming the example relative pressure sensor; Figure 9 illustrating the example substrate of Figure 8 following wire bonding and encapsulation.

[00016] Figure 10 is a sectional view of another example substrate for forming a relative pressure sensor.

[00017] Figure 11 is a top view of the example substrate of Figure 10.

[00018] Figure 12 is a sectional view of an example relative pressure sensor comprising the example substrate of Figure 10 after mounting of a pressure sensing die and securement of a cover to the example substrate. [00019] Figure 13 is an end view of the relative pressure sensor of Figure 12.

[00020] Figure 14 is a sectional view of another example relative pressure sensor.

[00021] Figure 15 is a sectional view of an example liquid supply

comprising an example sensing unit.

[00022] Figure 16 is a sectional view of another example liquid supply comprising an example sensing unit.

[00023] Figure 17 is a sectional view of the example sensing unit of Figure 16 taken along line 17-17.

[00024] Figure 18 is a sectional view of the example sensing unit of Figure 16 taken along line 18-18.

[00025] Figure 19 is a flow diagram of an example method for forming a substrate having a cavity and a channel and positioning a pressure sensing device with respect to the cavity.

[00026] Figure 20A is a sectional view of an example first stage of an example method for forming a relative pressure sensor.

[00027] Figure 20B is a top view of the example first stage shown in Figure 20A.

[00028] FIGURE 21A is a sectional view of an example second stage of the example method for forming the relative pressure sensor.

[00029] Figure 21 B is a top view of the example stage shown in Figure 21 A. [00030] Figure 22 is a sectional view of an example third stage of the example method for forming the relative pressure sensor.

[00031] Figure 23A is a sectional view of an example fourth stage of an example method for forming the relative pressure sensor.

[00032] Figure 23B is a top view of the example fourth stage shown in Figure 23A.

[00033] Figure 24A is a sectional view of an example fifth stage of an example method for forming the relative pressure sensor.

[00034] Figure 24B is a top view of the example fifth stage shown in Figure 24A.

[00035] Figure 25 is a front view of a portion of an example sensing unit including the relative pressure sensor.

DETAILED DESCRIPTION OF EXAMPLES

[00036] Relative pressure sensors are used to sense relative pressures with respect to different regionsSome of the current techniques for forming such relative pressure sensors may be complex and expensive. Figure 1 illustrates an example relative pressure sensor that is less complex and simpler to

manufacture as compared to many currently available relative pressure sensors.

[00037] Figures 1 -3 illustrate an example relative pressure sensor 20. Figure 1 is a top view of the example relative pressure sensor 20. Figure 2 is an end view of the example relative pressure sensor 20. Figure 3 is a sectional view of the example relative pressure sensor Figure 1 taken along line 3-3. Relative pressure sensor 20 comprises substrate 30, cavity 32, passage 34, membrane 38 and pressure sensing device 40. Substrate 30 comprises a carrier, base or platform for relative pressure sensor 20. Substrate 30 has a body in which are formed cavity 32 and passage 34. Cavity 32 extends into substrate 30 from a face 44 of substrate 30. Cavity 32 has a floor 48 and sidewalls 50. In the example illustrated, sidewalls 50 extend perpendicular to face 44 and

perpendicular to the plane containing the major dimensions of membrane 38 and pressure sensing device 40. For purposes of this disclosure, a "major

dimension" refers to the largest dimension, length width or height, of an object.

[00038] In one implementation, substrate 30 is molded to form cavity 32. In another implementation, substrate 30 undergoes a material removal process, such as micro-machining, to form cavity 32. In one implementation, substrate 30 is formed from a polymer. In one implementation, substrate 30 is formed from a thermoset polymer such as an epoxy molded compound. In one implementation, substrate 30 is formed from, or comprises, a glass, silicon, or other material.

[00039] Passage 34 comprises a conduit having a first opening 54 forming a port within cavity 32 and a second opening 56. In one implementation, cavity 32 and the overlying membrane 38 and pressure sensing device 40 are located within a first region while port 56 communicates with a second region, wherein pressure sensing device 40 output signals indicating differences in pressures between the first region and the second region. In the example illustrated, passage 34 extends along a line that lies in a plane that is parallel to the floor 48 of cavity 32. In other implementations, passage 32 may extend to cavity 32 along a line that extends in a plane that is oblique to the floor 48 of cavity 32.

[00040] In one implementation, passage 34 comprises a bore drilled or otherwise formed through the body of substrate 30, wherein passage 34 is surrounded on all sides by substrate 30 but for opening 54, 56. In another implementation, as will be described hereafter, passage 34 comprises a groove or channel formed in a face of substrate 30, the channel being bounded by substrate 30 on three sides, wherein a cover is secured to the face of substrate 30 over or opposite to the channel to form the completely bounded or completely surrounded passage 34.

[00041] Membrane 38 comprises a panel of a resiliently flexible material. In one implementation, membrane 30 comprises a thin silicon membrane.

Membrane 38 is secured to substrate 30 (directly or indirectly) over and across cavity 32 so as to span cavity 32, beyond opposing sidewalls 50, opposite to floor 48. Membrane 38 supports pressure sensing device 40.

[00042] Pressure sensing device 40 comprises a device that senses flexing of membrane 30 brought about by differences in pressure being exerted upon the exterior side of membrane 38 in the first region and pressure being exerted upon the interior side of membrane 38, adjacent cavity 32, and in communication with port 56 via passage 34. In one implementation, pressure sensing device 40 comprises a Wheatstone bridge having piezoresistors. In one implementation, portions a membrane 38 are doped to provide piezoresistors and the electrical traces forming the Wheatstone bridge. In other implementations, pressure sensing device 40 may comprise other types of pressure sensing devices.

Membrane 38 and pressure sensing device 40, together, form a pressure sensing die, that may be separately formed as a separate unit that is

subsequently mounted to substrate 30.

[00043] Figure 4 is a flow diagram of an example method 100 that may be used to form a relative pressure sensor, such as sensor 20 shown in Figures 1 -3. With respect to method 100, the order of the steps illustrated by blocks 104, 106 and 108 is not limited to the order of the illustrated blocks. As indicated by block 104, a cavity, such as cavity 32, a channel, such as channel 34, is formed in a substrate, such as substrate 30. The channel is formed such that it connects to a cavity, such as cavity 32, also in substrate 30. The channel that is formed is not enclosed on all sides, but comprises a groove extending into a face of the substrate.

[00044] As indicated by block 106, a pressure sensing device, such as pressure sensing device 40, is provided opposite to the cavity. In one

implementation, the pressure sensing device is supported by a membrane, wherein the membrane is positioned opposite to the cavity, such as opposite to the floor of the cavity within the substrate. As will the described hereafter, in one implementation, block 104 precedes block 106, wherein the pressure sensing device (and membrane) are secured to the substrate after the cavity and the channel have been formed in the substrate. In another implementation, block 104 proceeds block 106, wherein the pressure sensing device (and membrane) are supported by a carrier and wherein the substrate is formed on the carrier over the pressure sensing device (and membrane) and over a sacrificial layer which temporary fills and defines the cavity and the channel in the substrate being formed.

[00045] As indicated by block 108, a cover is secured to the substrate opposite the channel to form a passage, such as passage 34, leading to the cavity. In one implementation, the cover may comprise a layer of adhesive, entirely in liquid form, wherein the liquid has a viscosity so as to not completely flow into and fill the channel, but so as to form a ceiling or roof for the channel. In another implementation, the cover may comprise a film adhesive, a film, such as a fabric mesh or a solid polymeric panel or layer that is coated with an adhesive for being secured to the substrate. In one implementation, the cover may comprise a sheet or panel, which upon being sufficiently stimulated or activated, undergoes changes in its physical state so as to adhere, weld, fuse otherwise bonded to the substrate while extending over and across the channel without completely filling the channel. In yet other implementations, the cover may comprise a panel that is fastened, snapped onto, welded or otherwise secured to substrate 40 over the channel.

[00046] Figures 5-9 illustrate various stages of one example implementation of method 100 being carried out to form the completed relative pressure sensor 220 (shown in Figure 9). As shown in Figures 5A, 5B and 5C a substrate 230 is provided in which cavity 232 and channel 233 are formed. In one

implementation, cavity 232 and channel 233 are micro-machined into substrate 230. In another implementation, substrate 230 is molded to form cavity 232 and channel 233 are molded. In one implementation, substrate 230 comprises a polymer, such as a thermosetting polymer, such as an epoxy mold compound. In another implementation, substrate 230 comprises a glass or silicon material.

[00047] In the example illustrated, cavity 232 comprises a floor 248 and sidewalls 250. Sidewalls 250 obliquely extend from face 244 of substrate 230 and are also oblique with respect to floor 248. Sidewalls 250 form an acute angle (and angle less than 90°) with respect to the plane of face 244 within cavity 232. Sidewalls 250 form an obtuse angle (an angle greater than 90°) with respect to the plane of floor 248.

[00048] As illustrated by Figures 6A, 6B and 6C, a cover 235 is secured to substrate 230 opposite to or over channel 233 to form a completely surrounded passage 234. In the example illustrated, the cover comprises a deposit of liquid adhesive over channel 233, wherein the liquid adhesive has a viscosity which inhibits the liquid from completely filling channel 233, leaving passage 234. In the example illustrated, the liquid adhesive applied over channel 233 is further applied to face 244 of substrate 230 about cavity 232, wherein the liquid adhesive the subsequent use to secure the pressure sensing device to substrate 230 over cavity 232, opposite to floor 248 of cavity 232. The liquid adhesive assists in forming a seal between the subsequently mounted pressure sensing device and face 244 of substrate 230. In other implementations, cover 235 may comprise a panel or film coated with an adhesive on opposite faces, wherein the adhesive that is on one face bonds to face 244 of substrate 230 and wherein the adhesive on the other face bonds to a membrane supporting a pressure sensing device. As noted above, in some implementations, the adhesive on either face may be selectively activated through heat, light, chemical interaction or other catalysts.

[00049] Figures 7A and 7B illustrate one example pressure sensing device. Figures 7A and 7B illustrate an example pressure sensing die 236 which comprises membrane 238 and pressure sensing device 240. Membrane 238 is similar to membrane 38 described above. Pressure sensing device 240 is similar to pressure sensing device 40 described above. In the example illustrated, pressure sensing device 240 comprises a Wheatstone bridge having

piezoresistors. In other implementations, pressure sensing die 236 may comprise other types of pressure sensing devices 240.

[00050] Figure 8 is a top view illustrating the attachment of die 236 to substrate 230. In the example illustrated, die 236 is secured to face 244 of substrate 230 using the adhesive provided as part of cover 235 extending about cavity 232. In other implementations, a separate application of adhesive, distinct from the application of adhesive forming cover 235, may be employed for securing die 236 to substrate 230. In one implementation, the adhesive is cured to complete the bonding. In the example illustrated, the adhesive forms a seal between die 236 and face 244 of substrate 230.

[00051] Figure 9 is a top view illustrating wire bonding and encapping to complete relative pressure sensor 220. In particular, wire bonds or connections 257 are made to contact pads 258 of pressure sensing device 240. Thereafter, such wire bonds 257 and contact pads 258 are encapsulated by an electrically insulating wire encapsulating material 260 such as a polymeric encapsulating epoxy or other material.

[00052] Figures 10-13 illustrate another example implementation of the method 100 (shown in Figure 4) to form the example completed relative pressure sensor 320 shown in Figures 12 and 13. As shown by Figures 10 and 1 1 , substrate 330 is provided in which cavity 332 and channel 333 are formed. While cavity 332 extends into face 344 of substrate 330, channel 333 extends into face 345 of substrate 330 and communicates with a lower portion of channel 332 at a junction between faces 344, 345. In other implementations, rather than being formed on face 345 which is opposite to face 344, channel 333 may be formed along a side face of substrate 330, between faces 344, 345, and communicating with the interior of cavity 332 at an interior location spaced from each of the faces of substrate 330.

[00053] In one implementation, cavity 332 and channel 333 are micro- machined into substrate 330. In another implementation, substrate 330 is molded to form cavity 332 and channel 333. In one implementation, substrate 330 comprises a polymer, such as a thermosetting polymer, such as an epoxy mold compound. In another implementation, substrate 330 comprises a glass or silicon material.

[00054] As shown by Figures 12 and 13, die 236 (described above) is secured to face 344 of substrate 330 opposite to floor 348 of cavity 332, over and across cavity 332. In one implementation, die 236 is secured to face 344 of substrate 330 by an adhesive that extends between membrane 236 and face 344.

[00055] Cover 335 is similar to cover 235 except that cover 335 is secured to face 345 of substrate 330 opposite to channel 333. Cover 335 covers and spans across channel 333 to form the fully surrounded passage 334. In one implementation, cover 335 comprises a deposit of liquid adhesive over channel 333, wherein the liquid adhesive has a viscosity which inhibits the liquid from completely filling channel 333, leaving passage 334. In other implementations, cover 335 may comprise a panel or film coated with an adhesive on one face that bonds to face 345 of substrate 230. As noted above, in some implementations, the adhesive may be selectively activated through heat, light, chemical interaction or other catalysts.

[00056] Figure 14 is a sectional view of relative pressure sensor 420, another example implementation of relative pressure sensor 20. Relative pressure sensor 420 is similar to relative pressure sensor 320 except that cavity 332 is replaced with a cavity 432 that is formed by a passage or opening 451 and cover 435. Opening 451 completely extends through substrate 430 from face 444 to face 445. In one implementation, opening 451 is spaced from the perimeter or sides of substrate 230 the same as cavity 332 as shown Figure 1 1. Because opening 451 extends completely through substrate 230, opening 451 may be formed by molding or material removal processes without any depth control.

[00057] Cover 435 is similar to cover 335 except that cover 435 additionally spans across and covers a lower end of opening 451. As with cover 335, cover 435 is secured to face 445 of substrate 430 opposite to channel 333 so as to form the floor 437 of passage 434. As shown by Figure 14, cover 445

additionally forms the floor 448 of cavity 432 that extends opposite to membrane 238 and pressure sensing device 240 of pressure sensing die 236. In one implementation, depending on the size of opening 451 , cover 435 comprises a deposit of liquid adhesive that continuously extends across or over opening 432, wherein the liquid adhesive has a viscosity which inhibits the liquid from completely filling opening 451 , leaving cavity 432. In other implementations, cover 435 may comprise a panel or film coated with an adhesive on one face that bonds to face 445 of substrate 430. As noted above, in some implementations, the adhesive may be selectively activated through heat, light, chemical interaction or other catalysts.

[00058] Figure 15 is a sectional view of an example liquid supply 500 that includes the relative pressure sensor. Liquid supply 500 comprises liquid container 502 and sensing unit 504. Container 502 receives sensing unit 504 and forms an inner chamber 506 and a fluid interface 508. Chamber 506 comprises a volume for receiving or containing a liquid. Fluid interface 508 comprises a port through which liquid is removed from chamber 506. In one implementation, chamber 506 is filled with fluid through port 508. In other implementations, chamber 506 is filled through an alternative port. In one implementation, fluid interface 508 comprises a valve are selectively opening closing support provided by fluid interface 508.

[00059] Sensing unit 504 is mounted to container 502, partially extending into chamber 506 to sense characteristics of the liquid and contents of chamber 506. In the example illustrated, sensing unit 504 comprises relative pressure sensor 520, internal pressure sensor 570, liquid level sensor 572 and electrical interconnect 574. Relative pressure sensor 520 may comprise any one of relative pressure sensors 20, 220, 320 or 420 described above. Relative pressure sensor 520 comprises substrate 530, in which cavity 532 and passage 534 are formed, and pressure sensing die 236 described above. Cavity may comprise any of cavities 32, 232, 332 or 432 described above, wherein passage 534 may comprise any of passages 34, 234, 334 and 434 described above. In the example illustrating Figure 15, cavity 532 and pressure sensing die 236 are located within chamber 506 where passage 534 extends from cavity 532 across the walls of container 502 to port 556 in communication with the environment or ambient air. As a result, relative pressure sensor 520 senses the relative pressure between the interior of chamber 506 and the exterior of container 502. In other implementations, cavity 532 and pressure sensing die 236 may alternatively be supported outside of container 502, whereas port 506 terminates within chamber 506.

[00060] Substrate 530 is similar to any of the substrate 30, 230, 330 or 430 described above except that substrate 530 additionally supports internal pressure sensor 570, liquid level sensor 572 and electrical interconnect 574. Internal pressure 570 is supported within container 506 and senses the absolute pressure within container 506. In one implementation, internal pressure sensor 570 comprises a chamber over which a flexible diaphragm supports a pressure sensing device, such as a Wheatstone bridge having piezoresistors.

[00061] Liquid level sensor 572 comprises a device projecting into chamber 506 so as to output signals indicating a level of liquid within chamber 506.

Electrical interconnect 574 comprises electrical contact pads 578 facilitating electrical connection of each of sensors 520, 570 and 572 to an external controller or computing device. Electrical interconnect 574 is electrically connected to each of sensors 520, 570 and 572 (and to an acumen controller ASIC chip 573) through wire bonding, wherein the wire bonding and the acumen 573 are encapsulated with an encap layer 577. In other implementations, sensors 570 and 572 may be supported independent of substrate 530. In other implementations, sensors 570 and 572 may comprise other forms of internal pressure sensors and liquid level sensors, respectively.. In other

implementations, electrical interconnect 574 may comprise other forms of communication interfaces. In other implementations, sensors 570 and 572 may be omitted.

[00062] Figure 16 is a sectional view illustrating another example liquid supply 600. Liquid supply 600 is similar to liquid supply 500 except the liquid supply 600 includes sensing unit 604 in place of sensing unit 504. Figures 17 and 18 are sectional views of sensing unit 604. Those components or elements of liquid supply 600 which correspond to components or elements of liquid supply 500 are numbered similarly.

[00063] Sensing unit 604 is similar to sensing unit 504 except that substrate 530 supports cavity 232 and pressure sensing die 236 external to chamber 506, whereas passage 534 extends through and across the walls of container 502, terminating at port 656 which is within chamber 506. In the example illustrated, sensing unit 604 is specifically illustrated as comprising relative pressure sensor 230 described above, except that substrate 230 is replaced with substrate 530. Substrate 530 is similar to substrate 230 except that substrate 530 additionally supports sensors 570, 572 and electrical interconnect 574. In other

implementations, sensing unit 604 may alternatively comprise any of relative pressure sensors 320 and 420 described above. In the example illustrated, sensing unit 600 comprises a collar 659 that assists in forming a seal between sensing unit 600 and container 502.

[00064] Figure 19 is a flow diagram of an example method 700 for forming the cavity and channel of the above described relative pressure sensors 20, 220 as well as positioning a pressure sensing device relative to the cavity. Figures 20-25 illustrate various stages of an example method for forming the completed relative pressure sensor 220 (shown in Figure 25) pursuant to method 700.

Figures 20A and 20B illustrate the positioning of pressure sensing die 236 upon a carrier 802. To facilitate subsequent release of die 236 and overlying structures, a release mechanism 804, such as thermal release tape, is positioned upon carrier 802 between carrier 802 and die 236.

[00065] As indicated by block 702 of method 700 set forth in Figure 19 and illustrated in Figures 21 A and 21 B, a sacrificial layer 806 is formed upon carrier 802, over membrane 238 supporting pressure sensing device 240. As shown by Figure 21 B, the sacrificial layer 806 is located and shaped so as to have a negative relief pattern defining the subsequently formed cavity 232 and channel 233. In one implementation, the sacrificial layer 806 comprises a layer of lost wax. In other implementations, the sacrificial layer 806 may comprise other sacrificial materials.

[00066] As indicated by block 704 of Figure 19 and illustrated in Figure 22 substrate 230 is formed upon or over the sacrificial layer 806 supported by carrier 802. In one implementation, substrate 230 comprises a polymer that is moldable. In one implementation, substrate 230 comprises an epoxy mold compound that upon curing, forms a solid body.

[00067] As indicated by blocks 706 and 708 in Figure 19 and illustrated by Figures 23A and 23B, sacrificial layer 806 is removed and the substrate 230, along with the supported membrane 238 and pressure sensing device 240, forming die 236, are separated from carrier 802. In implementations where sacrificial layer 806 comprises lost wax, the lost wax is melted and drained, developed away by solvent, or otherwise removed. In implementations where the release mechanism 804 comprises a thermal release tape, heat is applied to the tape facilitating such separation. As shown by Figures 23A and 23B, removal of the sacrificial layer 806 leaves cavity 232, below pressure sensing die 236, and channel 233.

[00068] As shown by Figures 24A and 24B, once cavity 232 and channel 233 have been formed in substrate 230 as described above, the relative pressure sensor 230 is completed by performing steps similar to those illustrated in

Figures 8 and 9. In particular, cover 235 is formed opposite to channel 233 to complete passage 234. As shown by Figure 25, in one implementation, relative pressure sensor 220 may be provided as part of sensor unit 604 described above, wherein the substrate formed pursuant to block 704 further supports other sensors such as pressure sensor 570 and liquid level sensor 572 described above with respect to Figure 16.

[00069] Although the present disclosure has been described with reference to example implementations, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the claimed subject matter. For example, although different example implementations may have been described as including one or more features providing one or more benefits, it is contemplated that the described features may be interchanged with one another or alternatively be combined with one another in the described example implementations or in other alternative implementations. Because the technology of the present disclosure is relatively complex, not all changes in the technology are foreseeable. The present disclosure described with reference to the example implementations and set forth in the following claims is manifestly intended to be as broad as possible. For example, unless specifically otherwise noted, the claims reciting a single particular element also encompass a plurality of such particular elements. The terms "first", "second", "third" and so on in the claims merely distinguish different elements and, unless otherwise stated, are not to be specifically associated with a particular order or particular numbering of elements in the disclosure.