Title:
RELAY SUBSTRATE AND SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/149625
Kind Code:
A1
Abstract:
A relay substrate (5) for relaying a control substrate (1) for controlling an electrical device and a sensor substrate (2) comprising a sensor element (201), wherein the relay substrate (5) has: control-side relay substrate connectors (506, 507) to which a signal line (401) and a power source line (402) linked with the control substrate (1) are connected; a sensor-side relay substrate connector (505) to which a power source line (301) linked to the sensor substrate (2) and signal lines (302, 303) linked to the sensor substrate (2) are connected; relay substrate signal wirings (508, 509) for connecting terminals of the control-side relay substrate connectors (506, 507) and a terminal of the sensor-side relay substrate connector (505), an output signal from the sensor element (201) being inputted to the terminal of the sensor-side relay substrate connector (505); relay substrate power source wiring (511) connected to a terminal to which the power source line (402) of the control-side relay substrate connectors (506, 507) is connected; and pull-up resistors (501, 502) connected to the relay substrate signal wirings (508, 509) and the relay substrate power source wiring (511).
Inventors:
NOMURA KENTA (JP)
SUZUKI YOHEI (JP)
SUZUKI YOHEI (JP)
Application Number:
PCT/JP2016/056136
Publication Date:
September 08, 2017
Filing Date:
February 29, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01R31/00
Foreign References:
| JP2010226844A | 2010-10-07 | |||
| JP2013200161A | 2013-10-03 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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