Title:
RELEASABILITY IMPARTER, ADHESIVE COMPOSITION, LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/100705
Kind Code:
A1
Abstract:
An adhesive composition including a polymer having an amide bond and a polyorganosiloxane structure.
Inventors:
FUKUDA TAKUYA (JP)
SHINJO TETSUYA (JP)
SHINJO TETSUYA (JP)
Application Number:
PCT/JP2022/043009
Publication Date:
June 08, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C09J183/04; C09J183/05; C09J183/07; C09J183/14; H01L21/02
Domestic Patent References:
| WO2016021646A1 | 2016-02-11 | |||
| WO2018216732A1 | 2018-11-29 |
Foreign References:
| JP2010530919A | 2010-09-16 | |||
| JP2011509338A | 2011-03-24 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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