Title:
RELEASE AGENT FOR CIRCUIT BOARD RESIN FILM AND PRODUCTION METHOD FOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/270333
Kind Code:
A1
Abstract:
The present invention provides a release agent for a circuit board resin film, the release agent being able to release a resin film formed on a circuit board in a short amount of time, having a high resin film fragmentation performance, and having a low environmental burden. One embodiment of the present invention relates to a release agent for a circuit board resin film, the release agent containing the compound (component (A)) shown in formula (1) and a fatty alcohol (component (B)) having a carbon number of 1–6 and a molecular weight of 30–120, wherein the pH is at least 13.0 and less than 14.0, the content of component (A) is 0.1–5 mass%, and the content of component (B) is 5–40 mass%. Formula (1): R1-O-(A1O)a-H
(In formula (1), R1 represents a branched alkyl group having a carbon number of 6–10, A1O represents an oxyalkylene group having a carbon number of 2–3, and a, which is the average number of added moles of the oxyalkylene group, is a number from 2 to 15.)
Inventors:
EZUKA HIROKI (JP)
FUJITA HIROYA (JP)
FUJITA HIROYA (JP)
Application Number:
PCT/JP2022/023448
Publication Date:
December 29, 2022
Filing Date:
June 10, 2022
Export Citation:
Assignee:
NOF CORP (JP)
International Classes:
B08B3/04; C11D1/72; C11D3/20; C11D3/28; G03F7/42; H05K3/06
Domestic Patent References:
| WO2018047631A1 | 2018-03-15 | |||
| WO2018020837A1 | 2018-02-01 |
Foreign References:
| JP2019105670A | 2019-06-27 | |||
| JP2018087958A | 2018-06-07 | |||
| JP2008058624A | 2008-03-13 | |||
| JP2019117331A | 2019-07-18 | |||
| JP2019105670A | 2019-06-27 | |||
| JP2021104677A | 2021-07-26 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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