Title:
RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2019/131163
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a release film that has excellent mold conforming ability and heat resistance, is capable of suppressing formation of wrinkles during heating, is less liable to have variation in release properties even after having undergone major deformation, and enables suitable application to a manufacturing step, in particular, for a step for encapsulating a semiconductor. [Solution] This release film is to be used in a manufacturing step and satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30°C and 150°C as measured by TMA when the temperature is raised from 30°C to 200°C at a rate of 10°C/min, T1 (°C) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40°C. In at least one of the surfaces of the film, the surface free energy Sa (mN/mm) at 25°C, the surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180°C for 3 minutes, and the surface free energy Sc (mN/mm) after having been stretched by 50% at 180°C satisfy formulas (III) and (IV).
Formula (I): 0≤S1≤1.5
Formula (II): 0≤|S1-S0|/(T1-40)≤0.050
Formula (III): 0≤|Sa-Sb|≤15
Formula (IV): 0≤|Sa-Sc|≤15
Inventors:
SHOJI HIDEO (JP)
TANAKA TERUYA (JP)
MANABE ISAO (JP)
TANAKA TERUYA (JP)
MANABE ISAO (JP)
Application Number:
PCT/JP2018/045827
Publication Date:
July 04, 2019
Filing Date:
December 13, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B29C33/68; B29C43/32; B32B27/00; C08J7/043; C08J7/044; H01L21/56; C08J5/18
Foreign References:
| JP2017205901A | 2017-11-24 | |||
| JP2017177463A | 2017-10-05 | |||
| JP2012224082A | 2012-11-15 | |||
| JP2017013455A | 2017-01-19 |
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