Title:
RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2020/045338
Kind Code:
A1
Abstract:
Provided is a release film that is used to connect electronic components by thermocompression bonding, the release film including a heat resistant resin layer (A), and a release layer (B) disposed on one surface of the heat resistant resin layer (A), wherein the release layer (B) has a thickness of 5 μm or less.
Inventors:
SUZUKI TAKASHI (JP)
TANIMOTO SHUHO (JP)
NISHIURA KATSUNORI (JP)
ITOU YUICHI (JP)
MIZUTA YASUSHI (JP)
TAKAGI MASATOSHI (JP)
YOSHII HIROAKI (JP)
KINOSHITA JIN (JP)
TANIMOTO SHUHO (JP)
NISHIURA KATSUNORI (JP)
ITOU YUICHI (JP)
MIZUTA YASUSHI (JP)
TAKAGI MASATOSHI (JP)
YOSHII HIROAKI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2019/033243
Publication Date:
March 05, 2020
Filing Date:
August 26, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B32B27/00
Domestic Patent References:
| WO2015190478A1 | 2015-12-17 |
Foreign References:
| JP2017052901A | 2017-03-16 | |||
| JP2009215517A | 2009-09-24 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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