Title:
RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2021/060151
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a release film which exhibits superior release properties to the prior art and which can be advantageously used to produce a RtoR type flexible circuit board. The present invention is a release film having at least one release layer. The release film is characterized in that the release layer contains an aromatic polyester resin and has an orientation function f, as determined by formula (1) on the basis of an infrared absorption spectrum obtained using a total reflection measurement method, of 0.35 or more. In formula (1), A1 denotes the absorption intensity attributable to C=O stretching vibrations in an incident direction at which absorption attributable to C=O stretching vibrations is at a maximum (a first direction), and A2 denotes the absorption intensity attributable to C=O stretching vibrations in a direction that is perpendicular to the first direction (a second direction).
Inventors:
KAWAHARA RYOUSUKE (JP)
KOYAHARA HIROAKI (JP)
ROKUSHA YUUKI (JP)
KOYAHARA HIROAKI (JP)
ROKUSHA YUUKI (JP)
Application Number:
PCT/JP2020/035308
Publication Date:
April 01, 2021
Filing Date:
September 17, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B29C33/68; B32B27/36; C08J5/18; C08L67/02; B29K67/00
Domestic Patent References:
| WO2011111826A1 | 2011-09-15 | |||
| WO2019181948A1 | 2019-09-26 |
Foreign References:
| JP2016068371A | 2016-05-09 | |||
| JP2014213493A | 2014-11-17 | |||
| JP2015058691A | 2015-03-30 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: