Title:
RELEASE MATERIAL, RELEASE MATERIAL ARTICLE, AND PROCESS FOR PRODUCING THE RELEASE MATERIAL ARTICLE
Document Type and Number:
WIPO Patent Application WO2001064805
Kind Code:
A3
Abstract:
The present invention provides a release material formed by irradiating a release material precursor having a shear storage modulus of about 1x10<2> to about 3x10<6> Pa at 20 DEG C and a frequency of 1 Hz, wherein the release material has a contact angle of 15 DEG or more, measured using a mixed solution of methanol and water (volume ratio: 90/10) having a wet tension of 25.4 mN/m. The release material of the present invention has improved anchoring to certain substrates, ensuring relatively low release strength from certain pressure-sensitive adhesives, particularly even after the exposure to a high temperature. Thus, the release materials are capable of allowing the pressure-sensitive adhesive to maintain stable residual adhesion strength.
Inventors:
SUWA TOSHIHIRO (JP)
SHINOHARA MASARU (JP)
YASUI YUTAKA (JP)
TOMA TETSUYA (JP)
SHINOHARA MASARU (JP)
YASUI YUTAKA (JP)
TOMA TETSUYA (JP)
Application Number:
PCT/US2001/006423
Publication Date:
March 07, 2002
Filing Date:
February 28, 2001
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
SUWA TOSHIHIRO (JP)
SHINOHARA MASARU (JP)
YASUI YUTAKA (JP)
TOMA TETSUYA (JP)
SUWA TOSHIHIRO (JP)
SHINOHARA MASARU (JP)
YASUI YUTAKA (JP)
TOMA TETSUYA (JP)
International Classes:
C08F220/12; C08J3/28; C09D4/02; C09J7/40; C09K3/00; (IPC1-7): C09J7/02
Foreign References:
| US4339485A | 1982-07-13 | |||
| US5393608A | 1995-02-28 |
Other References:
DATABASE WPI Section Ch Week 198839, Derwent World Patents Index; Class A14, AN 1988-275450, XP002175416
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