Title:
REPAIR DEVICE AND REPAIR METHOD
Document Type and Number:
WIPO Patent Application WO/2011/086816
Kind Code:
A1
Abstract:
This repair device is provided with a casing, a slide shaft which is disposed in such a way as to be slidable with respect to this casing, a turntable which is disposed in such a way as to be rotatable with respect to this slide shaft, a cutting mechanism which is provided to this turntable and has a cutting tool, and an advancing/reversing mechanism whereby the rotation radius of the cutting mechanism pertaining to turntable rotation is caused to undergo advancing/reversing displacement. With the casing aligned and positioned with respect to a pipe, the turntable undergoes rotational displacement while the slide shaft slides in the axial direction, and furthermore, the advancing/reversing mechanism causes the cutting mechanism to undergo advancing/reversing displacement. As a result, the cutting tool cuts the inner peripheral surface of the pipe while rotating spirally along the inner peripheral surface shape of the pipe.
Inventors:
ONISHI, Ken (())
Application Number:
JP2010/072908
Publication Date:
July 21, 2011
Filing Date:
December 20, 2010
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
International Classes:
B23B39/14; B23K31/00; B23K37/08; B23P6/00; B23Q17/20; G21C17/003; G21C19/02
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)
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Claims: