Title:
REPAIR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/086817
Kind Code:
A1
Abstract:
This repair device is provided with a casing, a slide shaft which is disposed in such a way as to be slidable with respect to this casing, a turntable which is disposed in such a way as to be rotatable with respect to this slide shaft, and a cutting mechanism which is provided to this turntable and has a cutting tool. Furthermore, the turntable undergoes rotational displacement while the slide shaft slides in the axial direction, with the result that the cutting tool cuts the inner peripheral surface of a pipe base while rotating spirally. Moreover, the cutting mechanism is provided with a cutting tool switching section which switches a plurality of cutting tools.
Inventors:
ONISHI, Ken (())
Application Number:
JP2010/072909
Publication Date:
July 21, 2011
Filing Date:
December 20, 2010
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
International Classes:
B23B39/14; B23B29/32; B23K31/00; B23K37/08; G21C19/02
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)
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