Title:
REPAIR METHOD AND REPAIR MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/105089
Kind Code:
A1
Abstract:
Provided is a repair method in which a material that is capable of bonding at a relatively low temperature is used as a repair material in a repair section and a repair that exhibits excellent sealing properties and durability even when used under a high-humidity and high-temperature environment is performed by a simple operation. The repair method includes a step in which a damaged part (DP) of a member to be repaired (10) is covered with a repair material (303) and a step in which the repair material (303) is heated to a predetermined temperature. The member to be repaired (10) comprises a first metal such as Cu or the like at least on the surface thereof. The repair material (303) comprises a second metal such as Sn or the like. Heating causes integral bonding between the surface of the member to be repaired (10), an intermetallic compound that has a higher melting point than the melting point of the low-melting-point metal of one of the first metal and the second metal, and an alloy layer. Heating also causes a Cu-Ni alloy (high-melting-point metal) powder that is included in the repair material (303) to react with Sn (low-melting-point metal) powder and thereby create a Cu-Ni-Sn alloy layer (37) that is a high-melting-point reaction product.
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Inventors:
ISHINO SATOSHI (JP)
KAWAGUCHI YOSHIHIRO (JP)
NAKANO KOSUKE (JP)
TAKAOKA HIDEKIYO (JP)
KAWAGUCHI YOSHIHIRO (JP)
NAKANO KOSUKE (JP)
TAKAOKA HIDEKIYO (JP)
Application Number:
PCT/JP2015/050108
Publication Date:
July 16, 2015
Filing Date:
January 06, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K3/06; B22F1/10; B23K1/14; B23K20/00
Domestic Patent References:
| WO2012108395A1 | 2012-08-16 | |||
| WO2010122764A1 | 2010-10-28 | |||
| WO2002099146A1 | 2002-12-12 |
Foreign References:
| JP2003211289A | 2003-07-29 | |||
| JP2002171055A | 2002-06-14 | |||
| JP2005297011A | 2005-10-27 | |||
| JP2007059506A | 2007-03-08 | |||
| JP2012176433A | 2012-09-13 | |||
| JP2008521619A | 2008-06-26 | |||
| JP2003527971A | 2003-09-24 | |||
| JP2003311469A | 2003-11-05 | |||
| US20010002982A1 | 2001-06-07 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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