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Patent Searching and Data


Title:
RESIN-BONDED WIRE SAW AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/209242
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin-bonded wire saw which achieves good cutting performance with little loss of abrasive grains and which suppresses the occurrence of wafer surface flaws during cutting. The resin-bonded wire has a resin bond layer with an oxygen gradient, is capable of achieving good cutting performance, improving the adhesion strength of the abrasive grains, and suppressing the occurrence of wafer surface flaws.

Inventors:
KONDO Takayuki (5-16 Shimizudani-cho, Tennoji-ku, Osaka-sh, Osaka 11, 〒5430011, JP)
Application Number:
JP2017/020437
Publication Date:
December 07, 2017
Filing Date:
June 01, 2017
Export Citation:
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Assignee:
TKX CORPORATION (5-16, Shimizudani-cho Tennoji-ku, Osaka-sh, Osaka 11, 〒5430011, JP)
International Classes:
B24D11/00; B24D3/28; B28D5/04; C09J11/04; C09J11/06; C09J161/04; C09J201/00; H01L21/304
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (Kojimachi Business Center, 5-3-1 Kojimachi, Chiyoda-k, Tokyo 83, 〒1020083, JP)
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