RESIN CARD MEDIUM AND MANUFACTURING METHOD THEREFOR

Title:

RESIN CARD MEDIUM AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2019/059305

Kind Code:

A1

Abstract:

[Problem] To provide, for a resin card having a substrate on which an electronic component is mounted, a resin card medium that has a high degree of flatness and smoothness without being provided with a layer having holes or the like for absorbing the thickness of an electronic component or the like, and to provide a manufacturing method therefor. [Solution] Provided is a resin card medium obtained by: preparing a prior-to-pressing card medium multilayer body by stacking, on a plastic first finishing sheet, a substrate having one or more electronic components mounted on one surface thereof such that the side on which the electronic components are mounted faces upward, and stacking a mixed paper sheet composed of plastic fibers and plant fibers on the substrate; and heat pressing the card medium multilayer body at a temperature equal to or greater than the softening point of the plastic fibers but less than the melting point of the plastic fibers. The card curvature amount is 1.5 mm or less in accordance with the standard ISO/IEC 7810:2003 and, separate from the ISO standard, the depth of a local recess is less than 0.2 mm.

Inventors:

NAKATA TOMOHIRO (JP)
MORIUCHI HIDEKI (JP)

Application Number:

PCT/JP2018/034895

Publication Date:

March 28, 2019

Filing Date:

September 20, 2018

Export Citation:

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Assignee:

SHOEI PRINTING CO LTD (JP)
TOMOEGAWA CO LTD (JP)

International Classes:

B42D25/305; B32B5/00; B32B9/02; B42D25/455; B42D25/46; G06K19/077

Foreign References:

JPH09275184A	1997-10-21
JPH1178317A	1999-03-23
JPH11139048A	1999-05-25
US20130240632A1	2013-09-19
JP2005242978A	2005-09-08
JP2004264665A	2004-09-24
JPH05229293A	1993-09-07
JPH09275184A	1997-10-21

Other References: