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Patent Searching and Data


Title:
RESIN CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/079198
Kind Code:
A1
Abstract:
This resin circuit board is provided with: a resin layer which has a via hole; a via conductor which is provided within the via hole; and a first conductor layer which is provided on one main surface of the resin layer and is connected to the via conductor. This resin circuit board is characterized in that: the via conductor comprises a first metal part that is in contact with the first conductor layer, and a second metal part; the first metal part contains a first metal which has a melting point that is lower than the upper temperature limit of the resin layer; and the second metal part contains a second metal which has a melting point that is equal to or higher than the upper temperature limit of the resin layer.

Inventors:
KAWAKAMI HIROMICHI (JP)
KATSUBE TSUYOSHI (JP)
MIZUSHIRO MASAAKI (JP)
Application Number:
JP2017/035779
Publication Date:
May 03, 2018
Filing Date:
October 02, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/11; H05K3/46
Foreign References:
JPH10190232A1998-07-21
JP2006108211A2006-04-20
JPH11204943A1999-07-30
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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