Title:
RESIN-CLAD COPPER FOIL, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/014079
Kind Code:
A1
Abstract:
Provided is a resin-clad copper foil that is capable of exhibiting exceptional interlayer adhesion and heat resistance when fashioned into a copper-clad laminated plate or a printed wiring board, despite the resin layer having exceptional dielectric properties that are suited to high-frequency applications. The resin layer is provided on at least one side of the copper foil in this resin-clad copper foil. The resin layer contains an imidazole-based curing catalyst and a resin mixture that contains an epoxy resin, a polyimide resin, and an aromatic polyamide resin.
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Inventors:
YONEDA YOSHIHIRO (JP)
MATSUSHIMA TOSHIFUMI (JP)
HOSOI TOSHIHIRO (JP)
KUWAKO FUJIO (JP)
MATSUSHIMA TOSHIFUMI (JP)
HOSOI TOSHIHIRO (JP)
KUWAKO FUJIO (JP)
Application Number:
PCT/JP2016/070332
Publication Date:
January 26, 2017
Filing Date:
July 08, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/08; B32B15/088; B32B15/092; H05K3/38
Domestic Patent References:
| WO2009145207A1 | 2009-12-03 |
Foreign References:
| JP2008284785A | 2008-11-27 | |||
| JP2006131690A | 2006-05-25 | |||
| JP2006328214A | 2006-12-07 | |||
| JP2009148962A | 2009-07-09 | |||
| JP2015091644A | 2015-05-14 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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