Title:
RESIN-CLAD METAL FOIL AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/130947
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin-clad metal foil (30) which has low resin fluidity and can suppress resin overflow during molding while maintaining good adhesive properties, flexibility, heat resistance and circuit filling properties. A first insulating layer (21) and a second insulating layer (22) are formed in that order on a metal foil (50). The first insulating layer (21) is formed from a polyimide resin layer (9), a polyamideimide resin layer (8), a liquid crystal polymer resin layer (4), a fluororesin layer (5) or a poly(phenylene ether) resin layer (6). The second insulating layer (22) is formed from a semi-cured polyolefin resin layer (3). The polyolefin resin layer (3) contains component (A), a polyolefin-based elastomer, and component (B), a thermosetting resin. The proportion of the polyolefin-based elastomer of component (A) in the overall polyolefin resin layer (3) is 50-95 mass%.
Inventors:
ISHIKAWA YOHSUKE
ESAKI YOSHIAKI
OZEKI TAKAYOSHI
TOCHIHIRA JUN (JP)
HARADA RYU (JP)
ESAKI YOSHIAKI
OZEKI TAKAYOSHI
TOCHIHIRA JUN (JP)
HARADA RYU (JP)
Application Number:
PCT/JP2017/002297
Publication Date:
August 03, 2017
Filing Date:
January 24, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
TOMOEGAWA CO LTD (JP)
TOMOEGAWA CO LTD (JP)
International Classes:
H05K1/03; B32B15/08; B32B15/088
Foreign References:
| JP2004315595A | 2004-11-11 | |||
| JPS6358997A | 1988-03-14 | |||
| JPH0521911A | 1993-01-29 | |||
| JP2014129520A | 2014-07-10 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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