Title:
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2011/010540
Kind Code:
A1
Abstract:
Provided is a resin composite electrolytic copper foil having a further increased thermal resistance, and an increased plating adhesion strength when a plating process is performed after a desmear process is performed in additive method processing.
A rough surface having a plurality of fine projections, a surface roughness (Rz) in the range of 1.0 μm to 3.0 μm, and a brightness value of 30 or lower, is formed on one surface of an electrolytic copper foil (A), and a layer of a resin composition (B) is formed on the rough surface, wherein the resin composition (B) contains a block copolymer polyimide resin (a) constituted by alternately and repeatedly connecting imide oligomers made of first and second building units.
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Inventors:
NOZAKI MITSURU (JP)
NOMOTO AKIHIRO (JP)
AKIYAMA NORIKATSU (JP)
NAGATA EIJI (JP)
YANO MASASHI (JP)
NOMOTO AKIHIRO (JP)
AKIYAMA NORIKATSU (JP)
NAGATA EIJI (JP)
YANO MASASHI (JP)
Application Number:
PCT/JP2010/061291
Publication Date:
January 27, 2011
Filing Date:
June 25, 2010
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
PI R & D CO LTD (JP)
NOZAKI MITSURU (JP)
NOMOTO AKIHIRO (JP)
AKIYAMA NORIKATSU (JP)
NAGATA EIJI (JP)
YANO MASASHI (JP)
PI R & D CO LTD (JP)
NOZAKI MITSURU (JP)
NOMOTO AKIHIRO (JP)
AKIYAMA NORIKATSU (JP)
NAGATA EIJI (JP)
YANO MASASHI (JP)
International Classes:
B32B15/088; C25D7/00; C25D7/06; H05K1/03; H05K3/38
Foreign References:
| JP2008254352A | 2008-10-23 | |||
| JPS6194756A | 1986-05-13 | |||
| JP2007281361A | 2007-10-25 | |||
| JP2008188778A | 2008-08-21 | |||
| JP2004289053A | 2004-10-14 | |||
| JPH08216340A | 1996-08-27 | |||
| JPH0911397A | 1997-01-14 | |||
| JP2005248323A | 2005-09-15 | |||
| JP2008254352A | 2008-10-23 | |||
| JPS411928B1 | ||||
| JPS4318468B1 | ||||
| JPS444791Y1 | 1969-02-21 | |||
| JPS4511712Y1 | 1970-05-25 | |||
| JPS4641112B1 | 1971-12-04 | |||
| JPS4726853Y1 | 1972-08-17 | |||
| JPS5163149A | 1976-06-01 |
Other References:
See also references of EP 2457725A4
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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