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Patent Searching and Data


Title:
RESIN COMPOSITE MATERIAL, CURING METHOD THEREOF, AND RESIN MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2016/194671
Kind Code:
A1
Abstract:
In order to simplify the equipment for heating a thermosetting resin or a thermoplastic resin and to reduce manufacturing costs of a resin molded product by saving energy, this resin composite material (1A-1I) is formed by combining a fibrous reinforcing material (2) and a thermosetting or thermoplastic matrix resin (3), wherein a metal nanomaterial (4) which self-heats after absorbing electromagnetic waves is added to the matrix resin (3). The frequency of the electromagnetic waves is preferably within the range of 3 MHz to 3 GHz. The metal nanomaterial (4) is preferably nanofibers or nanocoils, and the material is preferably platinum or gold.

Inventors:
KAMIHARA NOBUYUKI (JP)
ABE TOSHIO (JP)
Application Number:
PCT/JP2016/065139
Publication Date:
December 08, 2016
Filing Date:
May 23, 2016
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C08J5/10; B29C43/52; B29K105/08
Foreign References:
JP2013091728A2013-05-16
JPS62117731A1987-05-29
JPH06226741A1994-08-16
JPH03182309A1991-08-08
JPS6434733A1989-02-06
Other References:
See also references of EP 3263633A4
Attorney, Agent or Firm:
FUJITA, TAKAHARU (JP)
Takaharu Fujita (JP)
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